- 专利标题： Bonds for solar cell metallization
-
申请号： US16813258申请日： 2020-03-09
-
公开(公告)号： US10923616B2公开(公告)日： 2021-02-16
- 发明人: Richard Hamilton Sewell , Michel Arsène Olivier Ngamo Toko , Matthieu Moors , Jens Dirk Moschner
- 申请人： SunPower Corporation , Total Marketing Services
- 申请人地址： US CA San Jose; FR Puteaux
- 专利权人： SunPower Corporation,Total Marketing Services
- 当前专利权人： SunPower Corporation,Total Marketing Services
- 当前专利权人地址： US CA San Jose; FR Puteaux
- 代理机构： Schwabe, Williamson & Wyatt, P.C.
- 主分类号： H01L31/18
- IPC分类号： H01L31/18 ; H01L31/0224 ; B32B37/06 ; B32B38/00
摘要：
A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.
公开/授权文献
- US20200212248A1 BONDS FOR SOLAR CELL METALLIZATION 公开/授权日：2020-07-02
信息查询
IPC分类:
