公开(公告)号：US10338005B2

公开(公告)日：2019-07-02

申请号：US15765349

申请日：2016-08-03

申请人： SUMCO CORPORATION

发明人： Tatsuya Osada ,  Hideaki Kinbara ,  Masahiko Egashira

IPC分类号： G01N11/00 ,  G01N21/00 ,  G01N21/95 ,  G01B11/30 ,  G01N21/956 ,  G01N21/88 ,  G01N21/84

摘要： Provided is an apparatus for inspecting the back surface of an epitaxial wafer, capable of detecting defects in the back surface of an epitaxial wafer. An epitaxial wafer back surface inspection apparatus has an optical system including an annular fiber optic illuminator and an imaging unit which are placed perpendicular to the back surface of an epitaxial wafer; and a scanning unit operating the optical system in parallel with the back surface to scan the back surface. A light source of the annular fiber optic illuminator is composed of either blue LEDs or red LEDs.

公开(公告)号：US10161883B2

公开(公告)日：2018-12-25

申请号：US15757856

申请日：2016-08-03

申请人： SUMCO CORPORATION

发明人： Tatsuya Osada ,  Masahiko Egashira ,  Tomokatsu Uchino

IPC分类号： G01N21/95 ,  G01N21/64

摘要： Provided is a wafer inspection method capable of examining whether pits are formed in wafer surfaces. The wafer inspection method includes the steps of: choosing defects of a wafer using a first optical system; selecting potential pits from the chosen defects; and classifying the potential pits into pits and defects other than the pits using a second optical system.