公开(公告)号：US11554458B2

公开(公告)日：2023-01-17

申请号：US17055735

申请日：2019-02-13

申请人： SUMCO CORPORATION

发明人： Yuki Nakano ,  Katsuhisa Sugimori ,  Kazuaki Kozasa ,  Jiro Kajiwara ,  Katsutoshi Yamamoto ,  Takayuki Kihara ,  Ryoya Terakawa

IPC分类号： B24B37/32 ,  B24B7/22 ,  B24B37/10 ,  B24B57/02

摘要： A polishing head of a wafer polishing apparatus is provided with: a membrane head that can independently control a center control pressure pressing a center portion of a wafer, and an outer periphery control pressure pressing an outer peripheral portion of the wafer; an outer ring integrated with the membrane head so as to configure the outer peripheral portion of the membrane head; and a contact type retainer ring provided outside the membrane head. The membrane head has a central pressure chamber of a single compartment structure that controls the center control pressure, and an outer peripheral pressure chamber that is provided above the central pressure chamber, and that controls the outer periphery control pressure. A position of a lower end of the outer ring reaches at least a position of an inner bottom surface of the central pressure chamber.

公开(公告)号：US10744616B2

公开(公告)日：2020-08-18

申请号：US16062433

申请日：2016-11-04

申请人： SUMCO CORPORATION

发明人： Tomonori Kawasaki ,  Ryoya Terakawa

IPC分类号： B24B49/14 ,  B24B49/16 ,  B24B37/10 ,  B24B37/005 ,  B24B37/015 ,  B24B37/04 ,  B24B37/20

摘要： A wafer polishing method of polishing one surface of a wafer by rotating a rotating platen to which a polishing pad is affixed and a pressurizing head while supplying slurry onto the rotating platen and pressurizing/holding the wafer on the polishing pad with the pressurizing head, the method including: calculating an F/T value by monitoring a load current value F of a motor for rotating the rotating platen and a surface temperature T of the polishing pad during the wafer polishing; and controlling at least one of the rotation speed of the rotating platen and the polishing pressure of the pressurizing head based on the calculated F/T value.

公开(公告)号：US10710209B2

公开(公告)日：2020-07-14

申请号：US15770602

申请日：2016-10-12

申请人： SUMCO CORPORATION

发明人： Ryoya Terakawa ,  Ryuichi Tanimoto ,  Hironori Kaneko

IPC分类号： B24B37/30 ,  B32B3/08 ,  H01L21/67

摘要： A wafer polishing apparatus is provided with a rotating platen to which a polishing pad is affixed and a polishing head that holds a wafer placed on the polishing pad while pressing the wafer. The polishing head has a membrane that contacts the upper surface of the wafer and applying a pressing force thereto and a support plate that supports the membrane. The membrane has a main surface part facing the bottom surface of the support plate and a side surface part facing the outer peripheral edge surface of the support plate. The vertical tension due to the side surface part of the membrane is larger than the lateral tension due to the main surface part of the membrane.