公开(公告)号：US10710209B2

公开(公告)日：2020-07-14

申请号：US15770602

申请日：2016-10-12

申请人： SUMCO CORPORATION

发明人： Ryoya Terakawa ,  Ryuichi Tanimoto ,  Hironori Kaneko

IPC分类号： B24B37/30 ,  B32B3/08 ,  H01L21/67

摘要： A wafer polishing apparatus is provided with a rotating platen to which a polishing pad is affixed and a polishing head that holds a wafer placed on the polishing pad while pressing the wafer. The polishing head has a membrane that contacts the upper surface of the wafer and applying a pressing force thereto and a support plate that supports the membrane. The membrane has a main surface part facing the bottom surface of the support plate and a side surface part facing the outer peripheral edge surface of the support plate. The vertical tension due to the side surface part of the membrane is larger than the lateral tension due to the main surface part of the membrane.