公开(公告)号：US11554458B2

公开(公告)日：2023-01-17

申请号：US17055735

申请日：2019-02-13

申请人： SUMCO CORPORATION

发明人： Yuki Nakano ,  Katsuhisa Sugimori ,  Kazuaki Kozasa ,  Jiro Kajiwara ,  Katsutoshi Yamamoto ,  Takayuki Kihara ,  Ryoya Terakawa

IPC分类号： B24B37/32 ,  B24B7/22 ,  B24B37/10 ,  B24B57/02

摘要： A polishing head of a wafer polishing apparatus is provided with: a membrane head that can independently control a center control pressure pressing a center portion of a wafer, and an outer periphery control pressure pressing an outer peripheral portion of the wafer; an outer ring integrated with the membrane head so as to configure the outer peripheral portion of the membrane head; and a contact type retainer ring provided outside the membrane head. The membrane head has a central pressure chamber of a single compartment structure that controls the center control pressure, and an outer peripheral pressure chamber that is provided above the central pressure chamber, and that controls the outer periphery control pressure. A position of a lower end of the outer ring reaches at least a position of an inner bottom surface of the central pressure chamber.