公开(公告)号：US20240345229A1

公开(公告)日：2024-10-17

申请号：US18133299

申请日：2023-04-11

申请人： STMicroelectronics International N.V.

发明人： Colin CAMPBELL ,  Marco ANTONELLI ,  Calum RITCHIE ,  Bhagya Prakash BANDUSENA

IPC分类号： G01S7/4865 ,  G01S17/10 ,  H01L31/0203 ,  H01L31/0216 ,  H01L31/173

CPC分类号： G01S7/4865 ,  G01S17/10 ,  H01L31/0203 ,  H01L31/02162 ,  H01L31/173

摘要： A device includes an optical integrated circuit device mounted over an upper surface of a support substrate. The optical integrated circuit device includes an optical sensor array supported by a semiconductor substrate made of a first semiconductor material. A discrete semiconductor block, made of a second semiconductor material, is mounted over an upper surface of the optical integrated circuit device adjacent the optical sensor array. The first and second semiconductor materials have substantially matched coefficients of thermal expansion. A parallelpipedal-shaped optical filter is mounted over an upper surface of the discrete semiconductor block and extends over the optical sensor array. One or more edges/corners of the parallelpipedal-shaped optical filter cantilever over the optical sensor array without any provided support.