公开(公告)号：US20250138154A1

公开(公告)日：2025-05-01

申请号：US18915086

申请日：2024-10-14

Applicant: STMicroelectronics International N.V.

Inventor： Yandong MAO ,  Kai Quan CHENG ,  Tat Ming TEO ,  Fraser WILLIAMS ,  Dominique NUYTS

IPC: G01S7/481 ,  G01S17/08

Abstract: The present disclosure provides an optical sensor module. An example optical sensor module comprises: a light-emitting device; a light-receiving sensor; and a module cap adapted to at least partially cover the light-emitting device and the light-receiving sensor, the module cap comprising a metal casing and a molded part made of a molding material lining the inside surfaces of the metal casing.

公开(公告)号：US20250138156A1

公开(公告)日：2025-05-01

申请号：US18915213

申请日：2024-10-14

Applicant: STMICROELECTRONICS INTERNATIONAL N.V.

Inventor： Yandong MAO ,  Andrew John PRICE ,  Tat Ming TEO ,  Vincent BEIX ,  Justin CATANIA

IPC: G01S7/481 ,  G01J1/44 ,  H01S5/02345

Abstract: The present disclosure provides an optical sensor module. An example optical sensor module comprises: a light-emitting device; a module cap adapted to at least partially cover the light-emitting device, the module cap comprising a first opening located over the light-emitting device; at least a conductive strip assembled with, or included in, the module cap; a glass positioned in the first opening and/or covering the first opening, and adapted to transmit light signals emitted by the light-emitting device, the glass including a conductive trace; and at least a conductive wire formed by wire bonding, the at least one conductive wire electrically connecting the conductive trace to the at least one conductive strip.

公开(公告)号：US20250138153A1

公开(公告)日：2025-05-01

申请号：US18914985

申请日：2024-10-14

Applicant: STMicroelectronics International N.V.

Inventor： Yandong MAO ,  Tat Ming TEO ,  Fraser WILLIAMS ,  William HALLIDAY

IPC: G01S7/481 ,  H05K9/00

Abstract: The present disclosure provides a substrate assembly for an optical sensor module. An example substrate assembly for an optical sensor module comprising: a light-emitting device mounted on a first region of a substrate; a metal shielding assembly comprising a first metal shielding assembled to the substrate over the first region; and wherein the first metal shielding comprises a first opening providing an optical path for light emitted by the light-emitting device, the first opening being dimensioned such that the light-emitting device can be inserted through the first opening inside the first metal shielding.

公开(公告)号：US20250137841A1

公开(公告)日：2025-05-01

申请号：US18926250

申请日：2024-10-24

Applicant: STMicroelectronics International N.V.

Inventor： William HALLIDAY ,  Brandon Scott JOHNSON ,  Fraser WILLIAMS ,  Garrie VICKERS ,  Andrew John PRICE ,  Axel CROCHERIE ,  Yandong MAO ,  Fabrice MARTIN ,  Tat Ming TEO ,  Vincent BEIX ,  Justin CATANIA

IPC: G01J1/02 ,  G01J1/04 ,  G01J1/44

Abstract: Example embodiments of the present disclosure provide an optical module sensor. An example optical module sensor may include an optical radiation-emitting device, a reference, an optical radiation receiver positioned, an electromagnetic interference shield, and a housing cap. The housing cap may include a barrier wall positioned such that the housing cap defines a transmission cavity and a receiving cavity. The optical radiation-emitting device and the reference sensor may be positioned within the transmission cavity and the optical radiation receiver may be positioned within the receiving cavity. The housing cap may include an attenuation wall positioned between the reference sensor and the optical radiation receiver.

公开(公告)号：US20250138157A1

公开(公告)日：2025-05-01

申请号：US18915289

申请日：2024-10-14

Applicant: STMicroelectronics International N.V.

Inventor： Tat Ming TEO ,  Yandong MAO ,  Andrew John PRICE ,  William HALLIDAY

IPC: G01S7/481 ,  G01S17/04 ,  G01S17/08

Abstract: The present disclosure provides an optical sensor module. An example optical sensor module includes a light-emitting device; a light-receiving sensor; and a module cap adapted to at least partially cover the light-emitting device and the light-receiving sensor, the module cap being a molded cap, the molded cap being formed of a molding material comprising electrically conductive particles dispersed therein for providing electromagnetic interference shielding.

公开(公告)号：US20250138155A1

公开(公告)日：2025-05-01

申请号：US18915164

申请日：2024-10-14

Applicant: STMICROELECTRONICS INTERNATIONAL N.V.

Inventor： Yandong MAO ,  Tat Ming TEO ,  Fraser WILLIAMS

IPC: G01S7/481 ,  H05K1/18

Abstract: The present disclosure provides an optical sensor module. An example optical sensor module comprises: a substrate comprising first conductive pads; a module cap assembled on the substrate; a connecting flex incorporated in the module cap, the connecting flex being adapted to electrically couple at least one of the first conductive pads to at least one component mounted on and/or inside the module cap; and the connecting flex comprising at least one metal layer covered by, or encapsulated in, at least one dielectric layer.

公开(公告)号：US20250125279A1

公开(公告)日：2025-04-17

申请号：US18485523

申请日：2023-10-12

Applicant: STMicroelectronics International N.V.

Inventor： Kai Quan CHENG ,  Tat Ming TEO ,  Andrew John PRICE ,  William HALLIDAY ,  Bhagya Prakash BANDUSENA ,  Calum RITCHIE

IPC: H01L23/552 ,  H01L23/00

Abstract: An example apparatus and optical emission device for preventing the transmission of electromagnetic radiation to and from targeted electrical components of an electronic device are provided. The example apparatus may include an optical emissions component electrically connected to a target electrical portion and configured to generate an optical output. The example apparatus may further include a wire bond electromagnetic interference cage configured to block the passage of electromagnetic emissions. The wire bond electromagnetic interference cage may include a plurality of bond wires, wherein each bond wire is electrically coupled to an electrical ground, and wherein the wire bond electromagnetic interference cage overlays at least a portion of the target electrical portion. In addition, the wire bond electromagnetic interference cage may further define an electromagnetic interference cage opening through which the optical output passes.