公开(公告)号：US20250138154A1

公开(公告)日：2025-05-01

申请号：US18915086

申请日：2024-10-14

Applicant: STMicroelectronics International N.V.

Inventor： Yandong MAO ,  Kai Quan CHENG ,  Tat Ming TEO ,  Fraser WILLIAMS ,  Dominique NUYTS

IPC: G01S7/481 ,  G01S17/08

Abstract: The present disclosure provides an optical sensor module. An example optical sensor module comprises: a light-emitting device; a light-receiving sensor; and a module cap adapted to at least partially cover the light-emitting device and the light-receiving sensor, the module cap comprising a metal casing and a molded part made of a molding material lining the inside surfaces of the metal casing.

公开(公告)号：US20250125279A1

公开(公告)日：2025-04-17

申请号：US18485523

申请日：2023-10-12

Applicant: STMicroelectronics International N.V.

Inventor： Kai Quan CHENG ,  Tat Ming TEO ,  Andrew John PRICE ,  William HALLIDAY ,  Bhagya Prakash BANDUSENA ,  Calum RITCHIE

IPC: H01L23/552 ,  H01L23/00

Abstract: An example apparatus and optical emission device for preventing the transmission of electromagnetic radiation to and from targeted electrical components of an electronic device are provided. The example apparatus may include an optical emissions component electrically connected to a target electrical portion and configured to generate an optical output. The example apparatus may further include a wire bond electromagnetic interference cage configured to block the passage of electromagnetic emissions. The wire bond electromagnetic interference cage may include a plurality of bond wires, wherein each bond wire is electrically coupled to an electrical ground, and wherein the wire bond electromagnetic interference cage overlays at least a portion of the target electrical portion. In addition, the wire bond electromagnetic interference cage may further define an electromagnetic interference cage opening through which the optical output passes.