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公开(公告)号：US20250138157A1
公开(公告)日：2025-05-01
申请号：US18915289
申请日：2024-10-14
Applicant: STMicroelectronics International N.V.
Inventor： Tat Ming TEO , Yandong MAO , Andrew John PRICE , William HALLIDAY
Abstract: The present disclosure provides an optical sensor module. An example optical sensor module includes a light-emitting device; a light-receiving sensor; and a module cap adapted to at least partially cover the light-emitting device and the light-receiving sensor, the module cap being a molded cap, the molded cap being formed of a molding material comprising electrically conductive particles dispersed therein for providing electromagnetic interference shielding.
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公开(公告)号：US20250125279A1
公开(公告)日：2025-04-17
申请号：US18485523
申请日：2023-10-12
Applicant: STMicroelectronics International N.V.
Inventor： Kai Quan CHENG , Tat Ming TEO , Andrew John PRICE , William HALLIDAY , Bhagya Prakash BANDUSENA , Calum RITCHIE
IPC: H01L23/552 , H01L23/00
Abstract: An example apparatus and optical emission device for preventing the transmission of electromagnetic radiation to and from targeted electrical components of an electronic device are provided. The example apparatus may include an optical emissions component electrically connected to a target electrical portion and configured to generate an optical output. The example apparatus may further include a wire bond electromagnetic interference cage configured to block the passage of electromagnetic emissions. The wire bond electromagnetic interference cage may include a plurality of bond wires, wherein each bond wire is electrically coupled to an electrical ground, and wherein the wire bond electromagnetic interference cage overlays at least a portion of the target electrical portion. In addition, the wire bond electromagnetic interference cage may further define an electromagnetic interference cage opening through which the optical output passes.
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公开(公告)号：US20250138153A1
公开(公告)日：2025-05-01
申请号：US18914985
申请日：2024-10-14
Applicant: STMicroelectronics International N.V.
Inventor： Yandong MAO , Tat Ming TEO , Fraser WILLIAMS , William HALLIDAY
Abstract: The present disclosure provides a substrate assembly for an optical sensor module. An example substrate assembly for an optical sensor module comprising: a light-emitting device mounted on a first region of a substrate; a metal shielding assembly comprising a first metal shielding assembled to the substrate over the first region; and wherein the first metal shielding comprises a first opening providing an optical path for light emitted by the light-emitting device, the first opening being dimensioned such that the light-emitting device can be inserted through the first opening inside the first metal shielding.
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公开(公告)号：US20250137841A1
公开(公告)日：2025-05-01
申请号：US18926250
申请日：2024-10-24
Applicant: STMicroelectronics International N.V.
Inventor： William HALLIDAY , Brandon Scott JOHNSON , Fraser WILLIAMS , Garrie VICKERS , Andrew John PRICE , Axel CROCHERIE , Yandong MAO , Fabrice MARTIN , Tat Ming TEO , Vincent BEIX , Justin CATANIA
Abstract: Example embodiments of the present disclosure provide an optical module sensor. An example optical module sensor may include an optical radiation-emitting device, a reference, an optical radiation receiver positioned, an electromagnetic interference shield, and a housing cap. The housing cap may include a barrier wall positioned such that the housing cap defines a transmission cavity and a receiving cavity. The optical radiation-emitting device and the reference sensor may be positioned within the transmission cavity and the optical radiation receiver may be positioned within the receiving cavity. The housing cap may include an attenuation wall positioned between the reference sensor and the optical radiation receiver.
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