公开(公告)号：US20250023227A1

公开(公告)日：2025-01-16

申请号：US18902287

申请日：2024-09-30

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  KyoungHee Park ,  KyungHwan Kim ,  SeungHyun Lee ,  SangJun Park

IPC: H01Q1/22 ,  H01L21/56 ,  H01L23/31 ,  H01L23/36 ,  H01L23/498 ,  H01L23/552 ,  H01L25/16 ,  H01R12/71 ,  H05K1/18 ,  H05K3/34

Abstract: A semiconductor device has a PCB with an antenna and a semiconductor package mounted onto the PCB. An epoxy molding compound bump is formed or disposed over the PCB opposite the semiconductor package. A first shielding layer is formed over the PCB. A second shielding layer is formed over the semiconductor package. A board-to-board (B2B) connector is disposed on the PCB or as part of the semiconductor package. A conductive bump is disposed between the semiconductor package and PCB.

公开(公告)号：US20230402343A1

公开(公告)日：2023-12-14

申请号：US17805951

申请日：2022-06-08

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： SeungHyun Lee ,  HeeSoo Lee

IPC: H01L23/367 ,  H01L23/522 ,  H01L23/373

CPC classification number: H01L23/3675 ,  H01L23/373 ,  H01L23/5225

Abstract: A semiconductor device has a substrate and a semiconductor die disposed over the substrate. A tape is disposed over the semiconductor die. An encapsulant is deposited over the substrate, semiconductor die, and tape. The tape is removed to leave a cavity in the encapsulant over the semiconductor die. A shielding layer is formed over the encapsulant and semiconductor die. A heat spreader is disposed over the shielding layer. The heat spreader includes a protrusion extending into the cavity of the encapsulant.

公开(公告)号：US20240312884A1

公开(公告)日：2024-09-19

申请号：US18184649

申请日：2023-03-15

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： YongMoo Shin ,  HeeSoo Lee ,  SeungHyun Lee

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49811 ,  H01L21/563 ,  H01L23/3128 ,  H01L25/18

Abstract: A semiconductor device has a substrate and an electrical component disposed over a first surface of the substrate. A first encapsulant is deposited over the first surface of the substrate. A second encapsulant is deposited over a second surface of the substrate with a via formed in the second encapsulant. A conductive material containing a graphene core shell is deposited in the via in the second encapsulant to form a conductive post. The graphene core shell can have a copper core with a graphene coating formed over the copper core. The conductive material has a matrix to embed the graphene core shell. The conductive material can have a plurality of cores covered by graphene and the graphene is interconnected within the conductive material to form an electrical path. The conductive material can have thermoset material or polymer or composite epoxy type matrix to embed the graphene core shell.

公开(公告)号：US12136759B2

公开(公告)日：2024-11-05

申请号：US17452855

申请日：2021-10-29

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  KyoungHee Park ,  KyungHwan Kim ,  SeungHyun Lee ,  SangJun Park

IPC: H05K1/18 ,  H01L21/56 ,  H01L23/31 ,  H01L23/36 ,  H01L23/552 ,  H01Q1/22 ,  H05K3/34 ,  H01L23/498 ,  H01L25/16 ,  H01R12/71

Abstract: A semiconductor device has a PCB with an antenna and a semiconductor package mounted onto the PCB. An epoxy molding compound bump is formed or disposed over the PCB opposite the semiconductor package. A first shielding layer is formed over the PCB. A second shielding layer is formed over the semiconductor package. A board-to-board (B2B) connector is disposed on the PCB or as part of the semiconductor package. A conductive bump is disposed between the semiconductor package and PCB.

公开(公告)号：US20230140748A1

公开(公告)日：2023-05-04

申请号：US17452855

申请日：2021-10-29

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  KyoungHee Park ,  KyungHwan Kim ,  SeungHyun Lee ,  SangJun Park

IPC: H01Q1/22 ,  H01L23/552 ,  H05K1/18 ,  H05K3/34

Abstract: A semiconductor device has a PCB with an antenna and a semiconductor package mounted onto the PCB. An epoxy molding compound bump is formed or disposed over the PCB opposite the semiconductor package. A first shielding layer is formed over the PCB. A second shielding layer is formed over the semiconductor package. A board-to-board (B2B) connector is disposed on the PCB or as part of the semiconductor package. A conductive bump is disposed between the semiconductor package and PCB.