Invention Application
- Patent Title: Antenna-in-Package Devices and Methods of Making
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Application No.: US18902287Application Date: 2024-09-30
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Publication No.: US20250023227A1Publication Date: 2025-01-16
- Inventor: HunTeak Lee , KyoungHee Park , KyungHwan Kim , SeungHyun Lee , SangJun Park
- Applicant: STATS ChipPAC Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01L21/56 ; H01L23/31 ; H01L23/36 ; H01L23/498 ; H01L23/552 ; H01L25/16 ; H01R12/71 ; H05K1/18 ; H05K3/34
Abstract:
A semiconductor device has a PCB with an antenna and a semiconductor package mounted onto the PCB. An epoxy molding compound bump is formed or disposed over the PCB opposite the semiconductor package. A first shielding layer is formed over the PCB. A second shielding layer is formed over the semiconductor package. A board-to-board (B2B) connector is disposed on the PCB or as part of the semiconductor package. A conductive bump is disposed between the semiconductor package and PCB.
Information query
