公开(公告)号：US12119371B2

公开(公告)日：2024-10-15

申请号：US17754825

申请日：2020-10-22

申请人： SONY GROUP CORPORATION ,  SONY SEMICONDUCTOR SOLUTIONS CORPORATION

发明人： Hiizu Ohtorii ,  Hiroshi Morita ,  Yusuke Oyama ,  Eiji Otani ,  Ken Kikuchi

IPC分类号： H01L27/15 ,  H01L33/58 ,  H01L33/64 ,  H05K1/02 ,  H05K1/18

CPC分类号： H01L27/156 ,  H01L33/58 ,  H01L33/64 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/189 ,  H05K2201/10121 ,  H05K2201/10151

摘要： The present technology relates to a light source apparatus that makes it possible to provide a widely applicable light source apparatus. A light source apparatus includes a transmissive board that transmits light emitted by a light-emitting element, a circuit board that drives the light-emitting element and is joined to the transmissive board, and a light-emitting board that has the light-emitting element and is connected to the circuit board via a first bump. Further, in the light source apparatus, the circuit board and an organic board are configured to be connected by sandwiching the light-emitting board via second bumps. The present technology can be applied to a light source apparatus that emits light.

公开(公告)号：US12078561B2

公开(公告)日：2024-09-03

申请号：US17772053

申请日：2020-10-12

申请人： SONY GROUP CORPORATION ,  SONY SEMICONDUCTOR SOLUTIONS CORPORATION

发明人： Tomoko Katsuhara ,  Hiizu Ohtorii ,  Kei Tsukamoto

IPC分类号： G01L1/24 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18

CPC分类号： G01L1/247 ,  G01L1/241 ,  H05K1/0274 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/0367 ,  H05K2201/10151

摘要： An optical sensor according to an embodiment of the present disclosure includes a light emitting substrate and a circuit board. The light emitting substrate includes a light emitting device. The circuit board is provided at a position opposing the light emitting device. The circuit board includes a light transmitting section and one or multiple light receiving devices. The light transmitting section transmits light of the light emitting device. The one or multiple light receiving devices receive light reflected by a reflective layer of the light of the light emitting device exiting through the light transmitting section. For example, the one or multiple light receiving devices are formed on a first major surface of the circuit board. For example, the light emitting substrate is disposed at a position opposing a second major surface, of the circuit board, on an opposite side to the first major surface, and is stacked on the circuit board with a first bump interposed therebetween.

公开(公告)号：US12025738B2

公开(公告)日：2024-07-02

申请号：US17048203

申请日：2019-02-28

申请人： SONY CORPORATION ,  SONY SEMICONDUCTOR SOLUTIONS CORPORATION

发明人： Yusuke Oyama ,  Ken Kikuchi ,  Hiizu Ohtorii ,  Eiji Otani ,  Hiroshi Morita

IPC分类号： G01S7/481 ,  G01S17/08 ,  G02B3/00 ,  H01S5/0239

CPC分类号： G01S7/4812 ,  G01S17/08 ,  G02B3/00 ,  H01S5/0239 ,  G02B2003/0093

摘要： The present disclosure relates to a ranging device and a ranging module that allow a light emitting element and a light receiving element to be integrated with a simple structure. A light emitting substrate having a light emitting element is connected to a circuit substrate through first bumps, and a light receiving substrate having a single light emitting element or light emitting elements that are two-dimensionally disposed is connected to the circuit substrate through second bumps. The optical axis of a lens, the optical axis of the light emitting element, and the center axis of the light receiving element are disposed on substantially the same axis. The present technique can be applied to a ranging device that carries out ranging, and so forth.