Invention Grant
- Patent Title: Ranging device and ranging module
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Application No.: US17048203Application Date: 2019-02-28
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Publication No.: US12025738B2Publication Date: 2024-07-02
- Inventor: Yusuke Oyama , Ken Kikuchi , Hiizu Ohtorii , Eiji Otani , Hiroshi Morita
- Applicant: SONY CORPORATION , SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation,Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Corporation,Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Tokyo; JP Kanagawa
- Agency: Sheridan Ross PC
- Priority: JP 18084613 2018.04.26
- International Application: PCT/JP2019/007834 2019.02.28
- International Announcement: WO2019/207953A 2019.10.31
- Date entered country: 2020-10-16
- Main IPC: G01S7/481
- IPC: G01S7/481 ; G01S17/08 ; G02B3/00 ; H01S5/0239

Abstract:
The present disclosure relates to a ranging device and a ranging module that allow a light emitting element and a light receiving element to be integrated with a simple structure. A light emitting substrate having a light emitting element is connected to a circuit substrate through first bumps, and a light receiving substrate having a single light emitting element or light emitting elements that are two-dimensionally disposed is connected to the circuit substrate through second bumps. The optical axis of a lens, the optical axis of the light emitting element, and the center axis of the light receiving element are disposed on substantially the same axis. The present technique can be applied to a ranging device that carries out ranging, and so forth.
Public/Granted literature
- US20210156965A1 RANGING DEVICE AND RANGING MODULE Public/Granted day:2021-05-27
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