- 专利标题: Ranging device and ranging module
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申请号: US17048203申请日: 2019-02-28
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公开(公告)号: US12025738B2公开(公告)日: 2024-07-02
- 发明人: Yusuke Oyama , Ken Kikuchi , Hiizu Ohtorii , Eiji Otani , Hiroshi Morita
- 申请人: SONY CORPORATION , SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: Sony Corporation,Sony Semiconductor Solutions Corporation
- 当前专利权人: Sony Corporation,Sony Semiconductor Solutions Corporation
- 当前专利权人地址: JP Tokyo; JP Kanagawa
- 代理机构: Sheridan Ross PC
- 优先权: JP 18084613 2018.04.26
- 国际申请: PCT/JP2019/007834 2019.02.28
- 国际公布: WO2019/207953A 2019.10.31
- 进入国家日期: 2020-10-16
- 主分类号: G01S7/481
- IPC分类号: G01S7/481 ; G01S17/08 ; G02B3/00 ; H01S5/0239
摘要:
The present disclosure relates to a ranging device and a ranging module that allow a light emitting element and a light receiving element to be integrated with a simple structure. A light emitting substrate having a light emitting element is connected to a circuit substrate through first bumps, and a light receiving substrate having a single light emitting element or light emitting elements that are two-dimensionally disposed is connected to the circuit substrate through second bumps. The optical axis of a lens, the optical axis of the light emitting element, and the center axis of the light receiving element are disposed on substantially the same axis. The present technique can be applied to a ranging device that carries out ranging, and so forth.
公开/授权文献
- US20210156965A1 RANGING DEVICE AND RANGING MODULE 公开/授权日:2021-05-27
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