公开(公告)号：US12119371B2

公开(公告)日：2024-10-15

申请号：US17754825

申请日：2020-10-22

Applicant: SONY GROUP CORPORATION ,  SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： Hiizu Ohtorii ,  Hiroshi Morita ,  Yusuke Oyama ,  Eiji Otani ,  Ken Kikuchi

IPC: H01L27/15 ,  H01L33/58 ,  H01L33/64 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01L27/156 ,  H01L33/58 ,  H01L33/64 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/189 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: The present technology relates to a light source apparatus that makes it possible to provide a widely applicable light source apparatus. A light source apparatus includes a transmissive board that transmits light emitted by a light-emitting element, a circuit board that drives the light-emitting element and is joined to the transmissive board, and a light-emitting board that has the light-emitting element and is connected to the circuit board via a first bump. Further, in the light source apparatus, the circuit board and an organic board are configured to be connected by sandwiching the light-emitting board via second bumps. The present technology can be applied to a light source apparatus that emits light.

公开(公告)号：US12025738B2

公开(公告)日：2024-07-02

申请号：US17048203

申请日：2019-02-28

Applicant: SONY CORPORATION ,  SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： Yusuke Oyama ,  Ken Kikuchi ,  Hiizu Ohtorii ,  Eiji Otani ,  Hiroshi Morita

IPC: G01S7/481 ,  G01S17/08 ,  G02B3/00 ,  H01S5/0239

CPC classification number: G01S7/4812 ,  G01S17/08 ,  G02B3/00 ,  H01S5/0239 ,  G02B2003/0093

Abstract: The present disclosure relates to a ranging device and a ranging module that allow a light emitting element and a light receiving element to be integrated with a simple structure. A light emitting substrate having a light emitting element is connected to a circuit substrate through first bumps, and a light receiving substrate having a single light emitting element or light emitting elements that are two-dimensionally disposed is connected to the circuit substrate through second bumps. The optical axis of a lens, the optical axis of the light emitting element, and the center axis of the light receiving element are disposed on substantially the same axis. The present technique can be applied to a ranging device that carries out ranging, and so forth.