公开(公告)号：US10818717B2

公开(公告)日：2020-10-27

申请号：US16564444

申请日：2019-09-09

Applicant: SONY CORPORATION

Inventor： Hiroyasu Matsugai ,  Hiroyuki Itou ,  Suguru Saito ,  Keiji Ohshima ,  Masanori Iwasaki ,  Toshihiko Hayashi ,  Shuzo Sato ,  Nobutoshi Fujii ,  Hiroshi Tazawa ,  Toshiaki Shiraiwa ,  Minoru Ishida

IPC: H01L27/146 ,  B29D11/00 ,  G02B13/00 ,  G02B1/11

Abstract: A deformation of a stacked lens is suppressed.A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.

公开(公告)号：US10192924B2

公开(公告)日：2019-01-29

申请号：US15992479

申请日：2018-05-30

Applicant: SONY CORPORATION

Inventor： Takeshi Yanagita ,  Suguru Saito ,  Kaoru Koike

IPC: H01L27/146

Abstract: An image pickup device according to the present disclosure includes a first pixel and a second pixel each including a photodetection section and a light condensing section, the photodetection section including a photoelectric conversion element, the light condensing section condensing incident light toward the photodetection section, the first pixel and the second pixel being adjacent to each other and each having a step part on a photodetection surface of the photodetection section, in which at least a part of a wall surface of the step part is covered with a first light shielding section.

公开(公告)号：US11342371B2

公开(公告)日：2022-05-24

申请号：US16945247

申请日：2020-07-31

Applicant: SONY CORPORATION

Inventor： Hiroyasu Matsugai ,  Hiroyuki Itou ,  Suguru Saito ,  Keiji Ohshima ,  Masanori Iwasaki ,  Toshihiko Hayashi ,  Shuzo Sato ,  Nobutoshi Fujii ,  Hiroshi Tazawa ,  Toshiaki Shiraiwa ,  Minoru Ishida

IPC: H01L27/146 ,  B29D11/00 ,  G02B13/00 ,  G02B1/11

Abstract: A deformation of a stacked lens is suppressed.
A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.

公开(公告)号：US10431618B2

公开(公告)日：2019-10-01

申请号：US15567289

申请日：2016-07-15

Applicant: SONY CORPORATION

Inventor： Hiroyasu Matsugai ,  Hiroyuki Itou ,  Suguru Saito ,  Keiji Ohshima ,  Masanori Iwasaki ,  Toshihiko Hayashi ,  Shuzo Sato ,  Nobutoshi Fujii ,  Hiroshi Tazawa ,  Toshiaki Shiraiwa ,  Minoru Ishida

IPC: H01L27/146 ,  B29D11/00 ,  G02B13/00 ,  G02B1/11

Abstract: A deformation of a stacked lens is suppressed. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.

公开(公告)号：US10026773B2

公开(公告)日：2018-07-17

申请号：US15234821

申请日：2016-08-11

Applicant: SONY CORPORATION

Inventor： Takeshi Yanagita ,  Suguru Saito ,  Kaoru Koike

IPC: H01L27/146

Abstract: An image pickup device according to the present disclosure includes a first pixel and a second pixel each including a photodetection section and a light condensing section, the photodetection section including a photoelectric conversion element, the light condensing section condensing incident light toward the photodetection section, the first pixel and the second pixel being adjacent to each other and each having a step part on a photodetection surface of the photodetection section, in which at least a part of a wall surface of the step part is covered with a first light shielding section.

公开(公告)号：US09450005B2

公开(公告)日：2016-09-20

申请号：US14778738

申请日：2014-03-27

Applicant: SONY CORPORATION

Inventor： Takeshi Yanagita ,  Suguru Saito ,  Kaoru Koike

IPC: H01L27/142 ,  H01L27/144 ,  H01L27/146

CPC classification number: H01L27/14645 ,  H01L27/14607 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464

Abstract: An image pickup device according to the present disclosure includes a first pixel and a second pixel each including a photodetection section and a light condensing section, the photodetection section including a photoelectric conversion element, the light condensing section condensing incident light toward the photodetection section, the first pixel and the second pixel being adjacent to each other and each having a step part on a photodetection surface of the photodetection section, in which at least a part of a wall surface of the step part is covered with a first light shielding section.

Abstract translation: 根据本公开的图像拾取装置包括第一像素和第二像素，每个像素和第二像素均包括光电检测部分和聚光部分，光电检测部分包括光电转换元件，聚光部分将入射光聚焦到光电检测部分， 第一像素和第二像素彼此相邻，并且每个具有在光电检测部分的光电检测表面上的台阶部分，其中台阶部分的壁表面的至少一部分被第一遮光部分覆盖。