公开(公告)号：US10529752B2

公开(公告)日：2020-01-07

申请号：US16085452

申请日：2017-03-10

Applicant: SONY CORPORATION

Inventor： Hiroaki Ishiwata ,  Harumi Tanaka ,  Atsuhiro Ando

IPC: H01L27/146 ,  H04N5/369

Abstract: The present disclosure relates to an image pickup device and an electronic apparatus that enable warping of a substrate to be suppressed. A first structural body including a pixel array unit is layered with a second structural body including an input/output circuit unit and outputting a pixel signal output from the pixel to the outside of the device, and a signal processing circuit; and a signal output external terminal and a signal input external terminal are arranged below the pixel array unit, the signal output external terminal being connected to the outside via a first through-via penetrating through a semiconductor substrate in the second structural body, the signal input external terminal being connected to the outside via a second through-via connected to an input circuit unit and penetrating through the semiconductor substrate. The signal output external terminal is electrically connected to the first through-via via a first rewiring line, the signal input external terminal is electrically connected to the second through-via via a second rewiring line, and a third rewiring line being electrically independent is arranged in a layer in which the first rewiring line and the second rewiring line are arranged. The present disclosure can be applied to, for example, the image pickup device, and the like.

公开(公告)号：US10672809B2

公开(公告)日：2020-06-02

申请号：US16086404

申请日：2017-03-15

Applicant: SONY CORPORATION

Inventor： Harumi Tanaka ,  Yoshiaki Masuda ,  Shinji Miyazawa ,  Minoru Ishida

IPC: H01L27/146 ,  G01N21/78 ,  G01N21/64 ,  H01L23/48 ,  H01L31/054 ,  H04N5/349

Abstract: The present disclosure relates to a solid-state imaging apparatus that is configured by laminating a first structure body, at which a pixel array unit in which pixels for performing photoelectric conversion are two-dimensionally aligned is formed, and a second structure body, at which an output circuit unit for outputting a pixel signal outputted from the pixels to the outside of the apparatus is formed. The output circuit unit, a through via which penetrates a semiconductor substrate constituting a part of the second structure body, and a signal output external terminal connected to the outside of the apparatus are arranged under the pixel array unit of the first structure body, the output circuit unit is connected to the signal output external terminal via the through via, and the outermost surface of the apparatus is a resin layer formed on an upper layer of an on-chip lens of the pixel array unit.

公开(公告)号：US11031420B2

公开(公告)日：2021-06-08

申请号：US16688234

申请日：2019-11-19

Applicant: SONY CORPORATION

Inventor： Hiroaki Ishiwata ,  Harumi Tanaka ,  Atsuhiro Ando

IPC: H01L27/146 ,  H04N5/369

Abstract: The present disclosure relates to an image pickup device and an electronic apparatus that enable warping of a substrate to be suppressed. A first structural body including a pixel array unit is layered with a second structural body including an input/output circuit unit and outputting a pixel signal output from the pixel to the outside of the device, and a signal processing circuit; and a signal output external terminal and a signal input external terminal are arranged below the pixel array unit, the signal output external terminal being connected to the outside via a first through-via penetrating through a semiconductor substrate in the second structural body, the signal input external terminal being connected to the outside via a second through-via connected to an input circuit unit and penetrating through the semiconductor substrate. The signal output external terminal is electrically connected to the first through-via via a first rewiring line, the signal input external terminal is electrically connected to the second through-via via a second rewiring line, and a third rewiring line being electrically independent is arranged in a layer in which the first rewiring line and the second rewiring line are arranged. The present disclosure can be applied to, for example, the image pickup device, and the like.

公开(公告)号：US10923517B2

公开(公告)日：2021-02-16

申请号：US16854344

申请日：2020-04-21

Applicant: SONY CORPORATION

Inventor： Harumi Tanaka ,  Yoshiaki Masuda ,  Shinji Miyazawa ,  Minoru Ishida

IPC: H01L27/146 ,  G01N21/78 ,  G01N21/64 ,  H01L23/48 ,  H01L31/054 ,  H04N5/369 ,  H04N5/349

Abstract: The present disclosure relates to reducing the size of a solid-state imaging apparatus. The solid-state imaging apparatus is configured by laminating a first structure body, comprising a pixel array unit in which pixels for performing photoelectric conversion are two-dimensionally aligned, and a second structure body, comprising an output circuit unit for outputting a pixel signal. The output circuit unit, including a through via which penetrates a semiconductor substrate constituting a part of the second structure body, and a signal output external terminal connected to the outside of the apparatus are arranged under the first structure body, the output circuit unit is connected to the signal output external terminal via the through via, and the outermost surface of the apparatus is a resin layer formed on an upper layer of an on-chip lens of the pixel array unit.

公开(公告)号：US11973091B2

公开(公告)日：2024-04-30

申请号：US17148207

申请日：2021-01-13

Applicant: SONY CORPORATION

Inventor： Harumi Tanaka ,  Yoshiaki Masuda ,  Shinji Miyazawa ,  Minoru Ishida

IPC: H01L27/146 ,  G01N21/64 ,  G01N21/78 ,  H01L23/48 ,  H01L31/054 ,  H04N25/48 ,  H04N25/70

CPC classification number: H01L27/14605 ,  G01N21/64 ,  G01N21/78 ,  H01L23/481 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/0543 ,  H04N25/48 ,  H04N25/70 ,  G01N21/6454 ,  G01N2021/6471 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634

Abstract: The present disclosure relates to reducing the size of a solid-state imaging apparatus. The solid-state imaging apparatus is configured by laminating a first structure body, comprising a pixel array unit in which pixels for performing photoelectric conversion are two-dimensionally aligned, and a second structure body, comprising an output circuit unit for outputting a pixel signal. The output circuit unit, including a through via which penetrates a semiconductor substrate constituting a part of the second structure body, and a signal output external terminal connected to the outside of the apparatus are arranged under the first structure body, the output circuit unit is connected to the signal output external terminal via the through via, and the outermost surface of the apparatus is a resin layer formed on an upper layer of an on-chip lens of the pixel array unit.