公开(公告)号：US09163144B2

公开(公告)日：2015-10-20

申请号：US13961391

申请日：2013-08-07

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Saiko Akahane ,  Shigeo Yamaguchi ,  Tsutomu Kashiwagi

IPC: C08G77/08 ,  C08L83/04 ,  C03C25/00 ,  H01L33/56 ,  H01L33/48

CPC classification number: C08L83/04 ,  C03C25/00 ,  C03C25/1095 ,  C03C25/40 ,  C08G77/12 ,  C08G77/20 ,  C08K3/013 ,  C08K5/56 ,  C08K2003/2241 ,  C08K2003/2296 ,  C08L83/00 ,  H01L33/483 ,  H01L33/486 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2933/005 ,  Y10T428/249921 ,  Y10T442/2992 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides a silicone resin composition for producing a silicone laminated substrate by being impregnated in a glass cloth and cured therein, comprising: (A) an organopolysiloxane with a 3-dimensional network structure composed of an R1SiO1.5 unit and an R2SiO1.5 unit and a T unit represented by an RSiO1.5 unit; (B) an organohydrogenpolysiloxane composed of an R1SiO1.5 unit, an R12SiO unit and an R1aHbSiO(4-a-b)/2 unit; (C) a platinum group metal catalyst; and (D) a filler. There can be a silicone resin composition having a high glass transition temperature, a silicone laminated substrate excellent in properties such as heat resistance and weatherability having low thermal expansion coefficient and suppressed warp and deformation, a method for producing the same and an LED device.

Abstract translation: 本发明提供一种用于通过浸渍在玻璃布中并在其中固化而制造硅氧烷层压基材的硅树脂组合物，其包含：（A）具有由R1SiO1.5单元和R2SiO1.5组成的3维网络结构的有机聚硅氧烷 单位和由RSiO1.5单位表示的T单位; （B）由R1SiO1.5单元，R12SiO单元和R1aHbSiO（4-a-b）/ 2单元组成的有机氢聚硅氧烷; （C）铂族金属催化剂; 和（D）填料。 可以是玻璃化转变温度高的有机硅树脂组合物，具有低热膨胀系数和耐翘曲变形性的耐热性和耐候性等特性优异的硅酮层压基材，其制造方法和LED装置。