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公开(公告)号：US10177119B2
公开(公告)日：2019-01-08
申请号：US15619895
申请日：2017-06-12
发明人： Cong Zhang , Fuqiang Xiao , Bin Xu , Haijun Wu , Chin Tien Chiu , Zengyu Zhou
IPC分类号： H01L25/04 , H01L25/07 , H01L25/11 , H01L25/065 , H01L23/00 , H01L21/683 , H01L25/00 , H01L25/075 , H01L23/31 , H01L21/56
摘要： A semiconductor package is disclosed including a number of stacked semiconductor die, electrically connected to each other with wire bonds. The stacked semiconductor die are provided in a mold compound such that a spacing exists between a top die in the die stack and a surface of the mold compound. The wire bonds to the top die may be provided in the spacing. An RDL pad is affixed to the surface of the mold compound. Columns of bumps may be formed on the die bond pads of the top die in the die stack to electrically couple the RDL pad to the die stack across the spacing.
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公开(公告)号：US20180019228A1
公开(公告)日：2018-01-18
申请号：US15619895
申请日：2017-06-12
发明人： Cong Zhang , Fuqiang Xiao , Bin Xu , Haijun Wu , Chin Tien Chiu , Zengyu Zhou
IPC分类号： H01L25/065 , H01L23/00
CPC分类号： H01L25/0657 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L24/14 , H01L24/49 , H01L25/043 , H01L25/0652 , H01L25/071 , H01L25/074 , H01L25/0756 , H01L25/112 , H01L25/117 , H01L25/50 , H01L2224/1401 , H01L2224/49107 , H01L2225/06506 , H01L2225/06517 , H01L2225/06527 , H01L2225/06562 , H01L2924/1438 , H01L2924/15172 , H01L2924/181
摘要： A semiconductor package is disclosed including a number of stacked semiconductor die, electrically connected to each other with wire bonds. The stacked semiconductor die are provided in a mold compound such that a spacing exists between a top die in the die stack and a surface of the mold compound. The wire bonds to the top die may be provided in the spacing. An RDL pad is affixed to the surface of the mold compound. Columns of bumps may be formed on the die bond pads of the top die in the die stack to electrically couple the RDL pad to the die stack across the spacing.
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