公开(公告)号：US11848068B2

公开(公告)日：2023-12-19

申请号：US17851255

申请日：2022-06-28

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Byoungsul Kim ,  Hokyong Lee ,  Hwajin Jung ,  Yongjoo Choi

IPC分类号： G11C29/44 ,  G11C29/34 ,  G11C29/14 ,  G11C7/10 ,  G11C29/12 ,  G11C29/18

CPC分类号： G11C29/44 ,  G11C7/1045 ,  G11C29/14 ,  G11C29/34 ,  G11C2029/1202 ,  G11C2029/1204 ,  G11C2029/1802

摘要： A method for testing a memory chip including: performing an electrical die sorting (EDS) test on the memory chip; performing a package test when the EDS test is passed; performing a module test when the package test is passed; performing a mounting test when the module test is passed; and setting the memory chip to a mirroring mode through a fusing operation when the EDS test, the package test, the module test or the mounting test is failed.

公开(公告)号：US20220328122A1

公开(公告)日：2022-10-13

申请号：US17851255

申请日：2022-06-28

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Byoungsul KIM ,  Hokyong Lee ,  Hwajin Jung ,  Yongjoo Choi

IPC分类号： G11C29/44 ,  G11C29/34 ,  G11C29/14 ,  G11C7/10

摘要： A method for testing a memory chip including: performing an electrical die sorting (EDS) test on the memory chip; performing a package test when the EDS test is passed; performing a module test when the package test is passed; performing a mounting test when the module test is passed; and setting the memory chip to a mirroring mode through a fusing operation when the EDS test, the package test, the module test or the mounting test is failed.