公开(公告)号：US20190137451A1

公开(公告)日：2019-05-09

申请号：US16055409

申请日：2018-08-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoung-Whan OH ,  Won-Yup KO ,  Won-Ki PARK ,  Ho-Youl LEE ,  Young-IL JANG ,  Yeon-Woo CHOI ,  Yong-Won CHOI

IPC: G01N29/04 ,  G01N29/34 ,  G01N29/14

Abstract: A method for determining a position of a fault of equipment includes receiving a plurality of sound source signals from a plurality of sound source inputting apparatuses, determining an abnormal operation of the equipment by analyzing at least one sound source signal among the sound source signals, and extracting abnormal sound source signals from the sound source signals. The abnormal sound source signals are indicative of abnormal operation of the equipment. The method further includes determining a position of the abnormal operation based on a time difference between the abnormal sound source signals.

公开(公告)号：US20170178945A1

公开(公告)日：2017-06-22

申请号：US15348208

申请日：2016-11-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Won-Guk SEO ,  Yong-Won CHOI ,  Sang-Jin LEE ,  Yong-Bum JUNG ,  Seok HEO

IPC: H01L21/687 ,  C23C16/50 ,  C23C16/455 ,  B05D1/00 ,  H01L21/67 ,  C23C16/46

CPC classification number: H01L21/68707 ,  B05D1/005 ,  C23C16/45544 ,  C23C16/46 ,  C23C16/463 ,  C23C16/50 ,  C23C16/54 ,  C23C16/56 ,  H01L21/67103 ,  H01L21/67161 ,  H01L21/67178 ,  H01L21/67196 ,  H01L21/67742

Abstract: A substrate processing system includes an index module including wafer carriers. First and second heat processing units are disposed adjacent to the index module. Each of the first and second heat processing units includes a plurality of first heat processing plates sequentially stacked. First and second transfer robots are disposed adjacent to the first and second heat processing units, respectively. Each of the first and second transfer robots is movable along a vertical transfer path and to rotate. First and second coating units are disposed adjacent to first sides of the first and second transfer robots, respectively. Each of the first and second coating units includes a plurality of coating devices sequentially stacked. First and second bake units are disposed adjacent to second sides of the first and second transfer robots, respectively. Each of the first and second bake units includes a plurality of second heat processing plates sequentially stacked.