公开(公告)号：US20160049320A1

公开(公告)日：2016-02-18

申请号：US14635147

申请日：2015-03-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yeon-sik Choo ,  Soo-Jae Park ,  Jae-Heon Noh ,  Yong-Sang Cho

IPC: H01L21/673

CPC classification number: H01L21/67393

Abstract: A wafer carrier comprises a body part constructed and arranged to accommodate a wafer and including first and second layers which are stacked in sequence. A cover is mountable to the body part. A first air filter is positioned on the cover. A second air filter is positioned on a side of the body part. The second layer is positioned between the first layer and an inner region of the body part. A surface of the second layer facing the inner region is subjected to charge prevention processing.

Abstract translation: 晶片载体包括被构造和布置成容纳晶片并包括按顺序堆叠的第一和第二层的主体部分。 一个盖可以安装到身体部位。 第一个空气过滤器位于盖子上。 第二空气过滤器位于身体部分的一侧。 第二层位于主体部分的第一层和内部区域之间。 面对内部区域的第二层的表面经受电荷防止处理。

公开(公告)号：US09396979B2

公开(公告)日：2016-07-19

申请号：US14635147

申请日：2015-03-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeon-sik Choo ,  Soo-Jae Park ,  Jae-Heon Noh ,  Yong-Sang Cho

IPC: H01L21/673

CPC classification number: H01L21/67393

Abstract: A wafer carrier comprises a body part constructed and arranged to accommodate a wafer and including first and second layers which are stacked in sequence. A cover is mountable to the body part. A first air filter is positioned on the cover. A second air filter is positioned on a side of the body part. The second layer is positioned between the first layer and an inner region of the body part. A surface of the second layer facing the inner region is subjected to charge prevention processing.

Abstract translation: 晶片载体包括构造和布置成容纳晶片并包括依次层叠的第一和第二层的主体部分。 一个盖可以安装到身体部位。 第一个空气过滤器位于盖子上。 第二空气过滤器位于身体部分的一侧。 第二层位于主体部分的第一层和内部区域之间。 面对内部区域的第二层的表面经受电荷防止处理。