公开(公告)号：US20240181593A1

公开(公告)日：2024-06-06

申请号：US18228481

申请日：2023-07-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonkeun CHO ,  Eungchul KIM ,  Taesung KIM ,  Donghoon KWON ,  Hyunmo AN ,  Suengjun OH

IPC: B24B37/013

CPC classification number: B24B37/013

Abstract: A polishing process apparatus includes a carrier configured to support an object, a platen provided below the carrier and configured to accommodate at least one eddy current sensor, the at least one eddy current sensor including a coil configured to output an eddy current, a power supply circuit configured to supply power to the coil and a voltage detection circuit connected to the coil and configured to detect raw voltage data, a polishing pad on an upper surface of the platen, and a controller configured to acquire first data by receiving the raw voltage data from the voltage detection circuit a plurality of times while a polishing process is performed on the object, acquire second data by sequentially applying a first filter and a second filter to the first data, the first filter being different from the second filter and measure a thickness of a target layer included in the object based on the second data.

公开(公告)号：US20240238936A1

公开(公告)日：2024-07-18

申请号：US18230528

申请日：2023-08-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonkeun CHO ,  Donghoon Kwon

IPC: B24B37/10 ,  B24B49/14 ,  B24B53/017 ,  B24B57/02 ,  H01L21/67

CPC classification number: B24B37/107 ,  B24B49/14 ,  B24B53/017 ,  B24B57/02 ,  H01L21/67051

Abstract: Provided is a chemical mechanical polishing apparatus including a head part configured to support a wafer, a buffer part on the head part and configured to support a center of the wafer, and a first polishing part that is spaced apart from the buffer part and configured to be on an edge of the wafer.