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公开(公告)号:US12223164B2
公开(公告)日:2025-02-11
申请号:US18198372
申请日:2023-05-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sangho Park , Kwangyoun Kim , Sooam Kim , Jeewoong Kim , Joonjae Park , Dockjo Yang , Soonbae Yang , Soyong Lee , Boeun Jang , Youngwoong Joo
IPC: G06F3/04886 , G06F3/041 , G06F3/044 , G06F3/04817 , G06F3/16 , G06F3/0488 , H05B6/64
Abstract: An electronic device comprises: a panel; a sensor configured to detect a user's touch with respect to at least one region among a plurality of areas in the panel; a plurality of icon members positionable to an upper portion of the at least one region from among the plurality of regions of the panel based on the user's touch on the at least one region being detected by the sensor, the plurality of icon members being configured to respectively display icons corresponding to functions performable by the electronic device; and a processor configured to perform a function corresponding to an icon member based on the user's touch on the at least one region detected by the sensor occurring in association with the icon member.
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公开(公告)号:US11848573B2
公开(公告)日:2023-12-19
申请号:US17697349
申请日:2022-03-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dongoh Kang , Jungsuk Chu , Sooam Kim , Jaejin Kim , Namju Park
CPC classification number: H02J50/60 , H01Q1/38 , H02J50/005 , H02J50/12 , H02J50/402 , H02J50/80 , H02J50/90
Abstract: A wireless power transmission apparatus includes: a housing; a plate coupled with an upper portion of the housing; a power transmitting coil positioned inside the housing and configured to transmit wireless power to an electronic device put on the plate; a printed circuit board positioned between the plate and the power transmitting coil, and comprising at least one layer in which an antenna and a plurality of Foreign Object Detection (FOD) coils are formed; a processor electrically connected to the power transmitting coil and the printed circuit board; and a switch device configured to perform switching to a connection between the antenna and the processor or a connection between the plurality of FOD coils and the processor.
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