公开(公告)号：US09804323B2

公开(公告)日：2017-10-31

申请号：US14251881

申请日：2014-04-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Min Jong Bae ,  Jeong Hee Lee ,  Dong Earn Kim ,  Sang Eui Lee ,  Na Youn Won ,  Hyun A Kang ,  Shin Ae Jun

IPC: G02B6/00 ,  F21V8/00

CPC classification number: G02B6/0096 ,  Y10T29/49826

Abstract: A light source unit includes a light guide plate which includes a front surface and a rear surface which are opposite to each other and a side between and connecting the front surface and the rear surface, a light conversion device on the side of the light guide plate; and a light source which generates and supplies light to the light conversion device. The light conversion device includes, a sealed tube, a light conversion member within the sealed tube and a space other than an area in the tube which is occupied by the light conversion member, defined in the tube.

公开(公告)号：US10808169B2

公开(公告)日：2020-10-20

申请号：US15644984

申请日：2017-07-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeong Hee Lee ,  Hyun A Kang ,  Eun Joo Jang ,  Sang Eui Lee ,  Shin Ae Jun ,  Oul Cho ,  Tae Gon Kim ,  Tae Hyung Kim

IPC: C09K11/02 ,  G02F1/1335 ,  C09K11/59 ,  C01B17/20 ,  C08L33/04 ,  G02F1/361 ,  B24B1/00

Abstract: A method of grinding a semiconductor nanocrystal-polymer composite, the method including obtaining a semiconductor nanocrystal-polymer composite including a semiconductor nanocrystal and a first polymer, contacting the semiconductor nanocrystal-polymer composite with an inert organic solvent; and grinding the semiconductor nanocrystal-polymer composite in the presence of the inert organic solvent to grind the semiconductor nanocrystal-polymer composite.

公开(公告)号：US11021804B2

公开(公告)日：2021-06-01

申请号：US16176332

申请日：2018-10-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kenji Takai ,  Sang Eui Lee ,  Daiki Minami

IPC: C25D3/38 ,  C25D7/06 ,  H01B1/04 ,  H05K3/18 ,  H05K1/09 ,  C25D15/00 ,  C25D15/02 ,  H05K1/02 ,  C25D7/12

Abstract: A plating solution including a metal salt, a hydrophilic fullerene, and water, a metal composite material including a hydrophilic fullerene and a method of manufacturing the same, and a wire, a flexible printed circuit (FPC), and an electronic device including the metal composite material.

公开(公告)号：US10961414B2

公开(公告)日：2021-03-30

申请号：US16421568

申请日：2019-05-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kenji Takai ,  Sang Eui Lee ,  Ken Kokubo ,  Eigo Miyazaki ,  Do Yoon Kim

IPC: H01L21/321 ,  H01L21/306 ,  H01L21/304 ,  H01L21/302 ,  C09K3/14 ,  C09G1/02 ,  C09G1/00

Abstract: A polishing slurry including a composite including a hydrophilic fullerene and an ionic compound, a method of manufacturing the same, and a method of manufacturing a semiconductor device.

公开(公告)号：US09701898B2

公开(公告)日：2017-07-11

申请号：US14453723

申请日：2014-08-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeong Hee Lee ,  Hyun A Kang ,  Eun Joo Jang ,  Sang Eui Lee ,  Shin Ae Jun ,  Oul Cho ,  Tae Gon Kim ,  Tae Hyung Kim

IPC: C09K11/02 ,  B24B1/00

CPC classification number: C09K11/025 ,  B24B1/00 ,  C09K11/70

Abstract: A method of grinding a semiconductor nanocrystal-polymer composite, the method including obtaining a semiconductor nanocrystal-polymer composite including a semiconductor nanocrystal and a first polymer, contacting the semiconductor nanocrystal-polymer composite with an inert organic solvent; and grinding the semiconductor nanocrystal-polymer composite in the presence of the inert organic solvent to grind the semiconductor nanocrystal-polymer composite.

公开(公告)号：US10115496B2

公开(公告)日：2018-10-30

申请号：US15047790

申请日：2016-02-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soichiro Mizusaki ,  Sang Eui Lee ,  Won Suk Chang ,  In Taek Han

IPC: H01B1/24 ,  B82Y30/00

Abstract: A composition for preparing an electrically conductive composite includes, based on the total weight of the composition: about 37 weight percent to about 84 weight percent of an epoxy; about 0.001 weight percent to about 22 weight percent of an electrically conductive filler; and about 15 weight percent to about 45 weight percent of a thermoplastic resin, wherein the thermoplastic resin is a liquid at about 25° C., is miscible with the epoxy, and forms a domain upon heat curing that is phase-separated from the epoxy and the electrically conductive inorganic filler. Also composites prepared therefrom and an electronic device including the same.

公开(公告)号：US10020091B2

公开(公告)日：2018-07-10

申请号：US15190909

申请日：2016-06-23

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  The Industry & Academic Cooperation in Chungnam National University

Inventor： Sang Eui Lee ,  Yeonggyu Jeong ,  Kyoung-Seok Moon ,  Hiesang Sohn ,  Taewon Lee ,  In Taek Han

IPC: H01B1/24 ,  H01B1/22 ,  C08J5/00 ,  B82Y30/00

CPC classification number: H01B1/24 ,  B82Y30/00 ,  C08J5/005 ,  C08J2301/02 ,  D21H11/18 ,  D21H13/50 ,  D21H21/52 ,  H01B1/22 ,  Y10S977/752 ,  Y10S977/762 ,  Y10S977/783 ,  Y10S977/932

Abstract: A conductive composite including: a polymer matrix including a microcellulose fiber; and at least two conductive nanomaterials dispersed in the polymer matrix, wherein the conductive nanomaterial includes a metal nanowire, wherein the at least two of the conductive nanomaterials provide an assembled layer surrounding a surface of the microcellulose fiber.