公开(公告)号：US20240353350A1

公开(公告)日：2024-10-24

申请号：US18626396

申请日：2024-04-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kihong CHUNG ,  Gucheol KWON ,  Jaejoon KIM ,  Haemin JEONG ,  Minjae HUH ,  Hidong KWAK ,  Taejung PARK ,  Jihye LEE ,  Choonshik LEEM

IPC: G01N21/95 ,  G01N21/21 ,  G01N21/88 ,  H01L21/66

CPC classification number: G01N21/9501 ,  G01N21/211 ,  G01N21/8851 ,  H01L22/12 ,  G01N2021/8887

Abstract: A wafer abnormality detection method including: calculating a residual spectrum between a measured spectrum for a wafer and a predicted spectrum for the wafer; and performing machine learning to determine whether measurement data, which corresponds to the residual data, is abnormal.