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1.
公开(公告)号:US20240353350A1
公开(公告)日:2024-10-24
申请号:US18626396
申请日:2024-04-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kihong CHUNG , Gucheol KWON , Jaejoon KIM , Haemin JEONG , Minjae HUH , Hidong KWAK , Taejung PARK , Jihye LEE , Choonshik LEEM
CPC classification number: G01N21/9501 , G01N21/211 , G01N21/8851 , H01L22/12 , G01N2021/8887
Abstract: A wafer abnormality detection method including: calculating a residual spectrum between a measured spectrum for a wafer and a predicted spectrum for the wafer; and performing machine learning to determine whether measurement data, which corresponds to the residual data, is abnormal.
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公开(公告)号:US20190138892A1
公开(公告)日:2019-05-09
申请号:US16170081
申请日:2018-10-25
Inventor: Sungho KIM , Jinseok KIM , Yulhwa KIM , Jaejoon KIM , Dusik PARK
Abstract: A method of performing operations on a plurality of inputs and a same kernel using a delay time by using a same processor, and a neural network device thereof are provided, the neural network device includes input data including a first input and a second input, and a processor configured to obtain a first result by performing operations between the first input and a plurality of kernels, to obtain a second result by performing operations between the second input, which is received at a time delayed by a first interval from a time when the first input is received, and the plurality of kernels, and to obtain output data using the first result and the second result. The neural network device may include neuromorphic hardware and may perform convolutional neural network (CNN) mapping.
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