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公开(公告)号：US20210035913A1
公开(公告)日：2021-02-04
申请号：US16845890
申请日：2020-04-10
发明人： JONGHO PARK , Seung Hwan Kim , Jun Young Oh , Kyong Hwan Koh , Sangsoo Kim , Dong-Ju Jang
IPC分类号： H01L23/538 , H01L23/31 , H01L23/16 , H01L25/065
摘要： A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.
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公开(公告)号：US12132007B2
公开(公告)日：2024-10-29
申请号：US18103584
申请日：2023-01-31
发明人： Jongwan Kim , Kyong Hwan Koh , Juhyeon Oh , Yongkwan Lee
IPC分类号： H01L23/552 , H01L21/56 , H01L23/498 , H01L23/00
CPC分类号： H01L23/552 , H01L21/568 , H01L23/49816 , H01L23/49838 , H01L24/16 , H01L2224/16227
摘要： A semiconductor package including a substrate including at least one ground pad and a ground pattern; a semiconductor chip on the substrate; and a shield layer on the substrate and covering the semiconductor chip, wherein the shield layer extends onto a bottom surface of the substrate and includes an opening region on the bottom surface of the substrate, a bottom surface of the at least one ground pad is at the bottom surface of the substrate, a side surface of the ground pattern is at a side surface of the substrate, and the shield layer on the bottom surface of the substrate is in contact with the bottom surface of the at least one ground pad and in contact with the side surface of the ground pattern.
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公开(公告)号：US11996365B2
公开(公告)日：2024-05-28
申请号：US18114358
申请日：2023-02-27
发明人： Jongho Park , Seung Hwan Kim , Jun Young Oh , Kyong Hwan Koh , Sangsoo Kim , Dong-Ju Jang
IPC分类号： H01L23/538 , H01L23/16 , H01L23/31 , H01L25/065
CPC分类号： H01L23/5384 , H01L23/16 , H01L23/31 , H01L23/5385 , H01L25/0652
摘要： A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.
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公开(公告)号：US20230223347A1
公开(公告)日：2023-07-13
申请号：US18114358
申请日：2023-02-27
发明人： JONGHO PARK , Seung Hwan Kim , Jung Young Oh , Kyong Hwan Koh , Sangsoo Kim , Dong-Ju Jang
IPC分类号： H01L23/538 , H01L25/065 , H01L23/16 , H01L23/31
CPC分类号： H01L23/5384 , H01L23/5385 , H01L25/0652 , H01L23/16 , H01L23/31
摘要： A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.
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公开(公告)号：US11581266B2
公开(公告)日：2023-02-14
申请号：US17212035
申请日：2021-03-25
发明人： Jongwan Kim , Kyong Hwan Koh , Juhyeon Oh , Yongkwan Lee
IPC分类号： H01L23/552 , H01L23/498 , H01L21/56 , H01L23/00
摘要： A semiconductor package including a substrate including at least one ground pad and a ground pattern; a semiconductor chip on the substrate; and a shield layer on the substrate and covering the semiconductor chip, wherein the shield layer extends onto a bottom surface of the substrate and includes an opening region on the bottom surface of the substrate, a bottom surface of the at least one ground pad is at the bottom surface of the substrate, a side surface of the ground pattern is at a side surface of the substrate, and the shield layer on the bottom surface of the substrate is in contact with the bottom surface of the at least one ground pad and in contact with the side surface of the ground pattern.
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公开(公告)号：US12057357B2
公开(公告)日：2024-08-06
申请号：US17212417
申请日：2021-03-25
发明人： Kyong Hwan Koh , Jongwan Kim , Juhyeon Oh , Yongkwan Lee
IPC分类号： H01L23/48 , H01L21/48 , H01L21/56 , H01L23/13 , H01L23/31 , H01L23/498 , H01L23/52 , H01L23/00
CPC分类号： H01L23/13 , H01L21/4803 , H01L21/561 , H01L23/3107 , H01L23/49838 , H01L23/49827 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/06135 , H01L2224/48227 , H01L2224/49173 , H01L2224/73265
摘要： A semiconductor package includes a base substrate that includes a first surface and a second surface that face each other, a plurality of first metal line patterns disposed on the first surface, a plurality of second metal line patterns disposed on the second surface, a plurality of vias that penetrate the base substrate and connect the first metal line patterns to the second metal line patterns, a semiconductor chip disposed on the first surface, and a molding member that covers the first surface and the semiconductor chip. The base substrate includes at least one recess at a corner of the base substrate. The recess extends from the first surface toward the second surface. The molding member includes a protrusion that fills the recess.
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公开(公告)号：US11610845B2
公开(公告)日：2023-03-21
申请号：US17392705
申请日：2021-08-03
发明人： Jongho Park , Seung Hwan Kim , Jun Young Oh , Kyong Hwan Koh , Sangsoo Kim , Dong-Ju Jang
IPC分类号： H01L23/538 , H01L25/065 , H01L23/16 , H01L23/31
摘要： A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.
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公开(公告)号：US11107769B2
公开(公告)日：2021-08-31
申请号：US16845890
申请日：2020-04-10
发明人： Jongho Park , Seung Hwan Kim , Jun Young Oh , Kyong Hwan Koh , Sangsoo Kim , Dong-Ju Jang
IPC分类号： H01L23/538 , H01L23/31 , H01L23/16 , H01L25/065
摘要： A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.
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