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公开(公告)号：US11698234B2
公开(公告)日：2023-07-11
申请号：US16811949
申请日：2020-03-06
Applicant: Samsung Electronics Co., Ltd
Inventor： Sangmu Lee , Hyun Young Kim , Masaki Saito , Masatoshi Takahashi , Takeshi Takahara , Kangtae Seo , Kazushige Tajima , Ryo Inoha , Tsutomu Shimizu
CPC classification number: F28F9/0275 , F24F13/30 , F28F2009/0295
Abstract: An air conditioner including a distributor configured to distribute a fluid to a heat exchanger. The distributor comprises a main pipe; a partition defining a plurality of distribution paths in the main pipe; a first branched pipe inserted into the main pipe as much as first length, linked to a first distribution path of the plurality of distribution paths, connected to a first portion of the heat exchanger; and a second branched pipe inserted into the main pipe as much as second length different from the first length, linked to the first distribution path, connected to a second portion of the heat exchanger. A flow velocity of air exchanging heat at the first portion of the heat exchanger is faster than a flow velocity of air exchanging heat at the second portion of the heat exchanger. The first length is shorter than the second length.
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公开(公告)号：US20170176057A1
公开(公告)日：2017-06-22
申请号：US15258640
申请日：2016-09-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Nobukazu Shimodahira , Kimio Koda , Hongzhi Sun , Kazushige Tajima , Takahiro Akizuki
CPC classification number: F25B13/00 , F25B5/02 , F25B6/02 , F25B25/005 , F25B49/02 , F25B2313/003 , F25B2313/004 , F25B2313/005 , F25B2313/0233 , F25B2313/0253 , F25B2313/0315 , F25B2600/2513
Abstract: A heat exchange apparatus includes a first heat exchanger configured to transfer heat between a refrigerant and another medium, a plurality of second heat exchangers configured to transfer heat between the refrigerant and the liquid, a compressor configured to pressurize the refrigerant and a plurality of expansion devices for each of the plurality of second heat exchangers and configured to expand the refrigerant pressurized by the compressor, wherein the refrigerant flows through the plurality of second heat exchangers in parallel, and the liquid flows through the plurality of second heat exchangers in series.
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公开(公告)号：US12140326B2
公开(公告)日：2024-11-12
申请号：US17559567
申请日：2021-12-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hisashi Takeichi , Hyunyoung Kim , Ryo Inoha , Kazushige Tajima , Masatoshi Takahashi
IPC: F24F1/0059
Abstract: A heat exchanger includes a main pipe through which refrigerant flows, a plurality of tubes connected to the main pipe to allow refrigerant passing through the plurality of tubes to exchange heat with air, and a refrigerant distributor disposed between the main pipe and the plurality of tubes, to distribute refrigerant passing through the main pipe to the plurality of tubes. The refrigerant distributor includes an upstream structure connected to the main pipe and including a plurality of first distribution flow paths to which the refrigerant passing through the main pipe are distributed, and a downstream structure including a plurality of second distribution flow paths communicating with the plurality of first distribution flow paths, and a plurality of refrigerant outlets communicating with the plurality of second distribution flow paths so as to allow the refrigerant to be discharged to the plurality of tubes.
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公开(公告)号：US11629891B2
公开(公告)日：2023-04-18
申请号：US16483378
申请日：2018-02-02
Applicant: Samsung Electronics Co., Ltd
Inventor： Masaki Saito , Takeshi Takahara , Kimio Koda , Kazushige Tajima
Abstract: The present disclosure relates to a heat pump system comprising an outdoor unit disposed in an outdoor space, a plurality of thermal load units supplied with cool air and hot air, and an intermediate unit disposed between the outdoor unit and the plurality of thermal load units, wherein the intermediate unit is connected to the outdoor unit through refrigerant pipes and connected to the plurality of thermal load units through thermal medium pipes.
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