公开(公告)号：US20170176057A1

公开(公告)日：2017-06-22

申请号：US15258640

申请日：2016-09-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Nobukazu Shimodahira ,  Kimio Koda ,  Hongzhi Sun ,  Kazushige Tajima ,  Takahiro Akizuki

IPC: F25B13/00 ,  F25B5/02 ,  F25B49/02 ,  F25B6/02

CPC classification number: F25B13/00 ,  F25B5/02 ,  F25B6/02 ,  F25B25/005 ,  F25B49/02 ,  F25B2313/003 ,  F25B2313/004 ,  F25B2313/005 ,  F25B2313/0233 ,  F25B2313/0253 ,  F25B2313/0315 ,  F25B2600/2513

Abstract: A heat exchange apparatus includes a first heat exchanger configured to transfer heat between a refrigerant and another medium, a plurality of second heat exchangers configured to transfer heat between the refrigerant and the liquid, a compressor configured to pressurize the refrigerant and a plurality of expansion devices for each of the plurality of second heat exchangers and configured to expand the refrigerant pressurized by the compressor, wherein the refrigerant flows through the plurality of second heat exchangers in parallel, and the liquid flows through the plurality of second heat exchangers in series.