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公开(公告)号:US20240006563A1
公开(公告)日:2024-01-04
申请号:US18084186
申请日:2022-12-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyunjoon KIM , Seogwoo HONG , Dongkyun KIM , Dongho KIM , Joonyong Park , Sanghoon SONG , Kyungwook Hwang , Junsik HWANG
IPC: H01L33/48 , H01L33/62 , H01L25/075
CPC classification number: H01L33/486 , H01L33/62 , H01L25/0753 , H01L2933/0066
Abstract: Disclosed are a method of transferring semiconductor chips. The method may include providing a first substrate, adhering a support substrate to the first substrate, supplying and aligning a plurality of semiconductor chips, partially adhering a second substrate to a first surface of the first substrate, separating the support substrate from the first substrate, and adhering the plurality of semiconductor chips to the second substrate by supplying a fluid to a periphery of a second surface of the first substrate and applying a pressure to the second surface.
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公开(公告)号:US20230141485A1
公开(公告)日:2023-05-11
申请号:US17735747
申请日:2022-05-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyunjoon KIM , Dongkyun Kim , Joonyong Park , Seogwoo Hong , Kyungwook Hwang , Junsik Hwang
IPC: H01L25/13 , H01L21/673
CPC classification number: H01L25/13 , H01L21/67333
Abstract: A device transfer substrate includes a plurality of recesses, wherein each of the plurality of recesses includes a first region having a shape of a first figure, a second region having a shape of a second figure, and an overlapping region formed as a portion of the first region partially overlaps a portion of the second region, wherein a maximum width of the overlapping region in a direction intersecting with a straight line passing through a center of the first figure and a center of the second figure is less than a diameter or a diagonal length of the first figure and less than a diameter or a diagonal length of the second figure.
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公开(公告)号:US20230131855A1
公开(公告)日:2023-04-27
申请号:US17713807
申请日:2022-04-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyunjoon KIM , Seogwoo HONG , Kyungwook HWANG , Dongkyun KIM , Joonyong PARK , Junsik HWANG
IPC: H01L33/38 , H01L33/62 , H01L33/24 , H01L25/075 , H01L33/00
Abstract: A light-emitting device and a display apparatus including the light-emitting device are provided. The light-emitting device includes a light-emitting cell including first and second electrodes arranged on an upper surface to be apart from each other, an extended layer in which the light-emitting cell is embedded and which has a width greater than a width of the light-emitting cell, and first and second electrode pads arranged on an upper surface of the extended layer to be apart from each other and respectively electrically connected to the first and second electrode.
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公开(公告)号:US20220262784A1
公开(公告)日:2022-08-18
申请号:US17667241
申请日:2022-02-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyungwook HWANG , Junsik HWANG , Dongho KIM , Hyunjoon KIM , Joonyong PARK , Seogwoo HONG
Abstract: Provided is a method of fabricating a hybrid element, the method including forming a plurality of first elements on a first substrate, separating a plurality of second elements grown on a second substrate from the second substrate, a material of the second substrate being different from a material of the first substrate, and transferring the plurality of second elements, separated from the second substrate, onto the first substrate, wherein, in the transferring, the plurality of second elements are spaced apart from each other by a fluidic self-assembly method, and wherein each of the plurality of second elements includes a shuttle layer grown on the second substrate, an element layer grown on the shuttle layer, and an electrode layer on the element layer.
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公开(公告)号:US20220122953A1
公开(公告)日:2022-04-21
申请号:US17315596
申请日:2021-05-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyungwook HWANG , Junsik HWANG , Hyunjoon KIM , Joonyong PARK , Seogwoo HONG
Abstract: Provided is a method of manufacturing a micro light emitting device array. The method includes forming a display transfer structure including a transfer substrate and a plurality of micro light emitting devices, where the transfer substrate includes at least two first alignment marks; preparing a driving circuit board, the driving circuit board including a plurality of driving circuits and at least two second alignment marks, arranging the display transfer structure and the driving circuit board to face each other so that the at least two first alignment marks and the at least two second alignment marks face one another and bonding the plurality of micro light emitting devices of the display transfer structure to the plurality of driving circuits.
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6.
公开(公告)号:US20170205554A1
公开(公告)日:2017-07-20
申请号:US15351950
申请日:2016-11-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seogwoo HONG , Dongsik SHIM , Dongouk KIM , Hyunjoon KIM , Joonyong PARK , Jihyun BAE , Bongsu SHIN , Sunghoon LEE , Jaeseung CHUNG
CPC classification number: G02B6/0031 , B29C65/48 , B29L2031/3475 , G02B6/0038 , G02B6/0065 , G02B6/0068 , G02B6/0088 , G02B27/22 , H04N13/32 , H04N13/39 , H04N2213/001
Abstract: A display apparatus including a directional backlight unit and a method of assembling the display apparatus are disclosed. The display apparatus includes an auxiliary structure coupled to an input coupler and a switch panel module.
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公开(公告)号:US20220246801A1
公开(公告)日:2022-08-04
申请号:US17519754
申请日:2021-11-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seogwoo HONG , Hyunjoon KIM , Joonyong PARK , Kyungwook HWANG , Junsik HWANG
Abstract: Provided is a light-emitting device including a body including a first semiconductor layer, an active layer, and a second semiconductor layer, a first electrode and a second electrode provided on a first surface of the body, the first electrode and the second electrode being in contact with the first semiconductor layer and the second semiconductor layer, respectively, and a third electrode and a fourth electrode provided on a second surface of the body, the third electrode and the fourth electrode being in contact with the first semiconductor layer and the second semiconductor layer, respectively.
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公开(公告)号:US20210303320A1
公开(公告)日:2021-09-30
申请号:US17263591
申请日:2019-04-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyungseok LEE , Jingu KANG , Kihun HEO , Hyojong KIM , Hakryoul KIM , Hyunjoon KIM , Donggyu AHN , Haewook LEE , Kwanhee JEONG , Mooyoung KIM , Minjung KIM
IPC: G06F9/455
Abstract: Various embodiments of the present invention relate to a method for managing a memory in a Java execution environment, and an electronic device for performing same, and an electronic device may comprise a processor and a memory electrically connected to the processor, wherein: the memory is configured to store multiple Java application programs, and stores instructions that, when executed, cause the processor to execute a virtual machine configured to execute at least one Java application stored in the memory; and when generation of an object is detected during execution of the Java application, the virtual machine executed by the processor generates a reference for the generated object, identifies an application, which has generated the object by a threshold or more, on the basis of the generated reference, and provides information on the identified application to the processor. Other embodiments may also be possible.
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9.
公开(公告)号:US20190087044A1
公开(公告)日:2019-03-21
申请号:US16134471
申请日:2018-09-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Eunhyoung CHO , Bonwon KOO , Hyunjoon KIM , Haesung KIM , Jungyun WON
CPC classification number: G06F3/0412 , G06F3/044 , G06K9/0002 , H01L27/323 , H01L27/3234 , H01L27/3244
Abstract: Provided are a pattern structure for preventing a moiré pattern from becoming visible, and a display apparatus using the same. The pattern structure includes a first element pattern including a plurality of first elements arranged regularly at a first pitch; a second element pattern including a plurality of second elements arranged regularly at a second pitch, the second element pattern being provided on the first element pattern; and a filling layer configured to fill gaps among the plurality of second elements, between adjacent ones thereof. A difference between transmittances of the second element and the filling layer is about 5% or less and thus, a moiré pattern occurring due to the overlapping of the first element pattern and the second element pattern may be prevented from becoming visible.
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公开(公告)号:US20180165494A1
公开(公告)日:2018-06-14
申请号:US15597299
申请日:2017-05-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyunjoon KIM
CPC classification number: G06K9/0002 , G02B27/286 , G06F3/044
Abstract: Provided is a touch sensor including a substrate; an electrode layer disposed on a top surface of the substrate, the electrode layer including a first electrode layer and a second layer that intersect each other, and a dielectric layer disposed between the first electrode layer and the second electrode layer; a transparent cover disposed on the electrode layer; and a random pattern layer including an aperiodic pattern. The random pattern layer reduces a Moire phenomenon that may occur when periodic pattern layers overlap.
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