公开(公告)号：US20240079395A1

公开(公告)日：2024-03-07

申请号：US18114039

申请日：2023-02-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonyong Park ,  Dongho KIM ,  Hyunjoon KIM ,  Seogwoo HONG ,  Hyungwook HWANG ,  Junsik HWANG

IPC: H01L25/13 ,  H01L21/673

CPC classification number: H01L25/13 ,  H01L21/67333

Abstract: A method of mass-transferring a plurality of micro semiconductor chips, including mass-transferring a plurality of first micro semiconductor chips onto a first substrate such that they are disposed in a plurality of first grooves of the first substrate; determining whether an empty first groove is present; and positioning a second micro semiconductor chip in the empty first groove, wherein the positioning may include transferring a plurality of second micro semiconductor chips onto a second substrate separate from the first substrate; and adsorbing the second micro semiconductor chip from the second substrate, and positioning the adsorbed second micro semiconductor chip in the empty first groove, using an electrostatic force or an electromagnetic force.