公开(公告)号：US20230011603A1

公开(公告)日：2023-01-12

申请号：US17812121

申请日：2022-07-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongmun CHOI ,  Hakju KIM ,  Yeongbeom KIM ,  Juree KIM ,  Jongcheol JANG ,  Hyunsuk CHOI

IPC: H05K5/03

Abstract: According to various embodiments of the disclosure, an electronic device may comprise a cover glass covering at least a first surface. The cover glass may include a color glass including an end having a first thickness and an end having a second thickness different from the first thickness and configured to sequentially vary in thickness from the first thickness to the second thickness, an attaching layer disposed under the color glass and including a shape corresponding to the sequentially varying shape of the color glass, and a printed layer disposed under the attaching layer.

公开(公告)号：US20210130974A1

公开(公告)日：2021-05-06

申请号：US16481137

申请日：2017-11-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hakju KIM ,  Se Jin KIM ,  Hosoon LEE ,  Seon-Jung KIM ,  Wanju SIN ,  Kyuin LEE ,  Jiwoon LIM ,  Jong Wan JEONG

IPC: C25D11/18 ,  C25D11/26 ,  C23C28/04 ,  H04M1/02 ,  C25D11/30

Abstract: According to various embodiments, a method for manufacturing a metal housing can be provided, comprising: a step of forming a metal base made of a metal material; a step of pretreating the surface of the metal base such that the surface has a predetermined gloss and flatness; an anodizing step of forming a predetermined oxide film on the flat surface of the metal base; a step of coloring the oxide film by using a colorant having a desired color; a sealing step for maintaining the performance and characteristics of the colorant on the colored oxide film; and a step of laminating at least one deposition layer on the upper part of the sealed oxide film.

公开(公告)号：US20230030545A1

公开(公告)日：2023-02-02

申请号：US17845041

申请日：2022-06-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyunghyun KIM ,  Poonggi JUNG ,  Seonjung KIM ,  Hakju KIM ,  Jiwoon LIM ,  Jongmun CHOI ,  Hyunsuk CHOI

IPC: H05K5/03 ,  H05K5/00

Abstract: An electronic device, rear plate, and method of forming the rear plate are disclosed. The electronic device includes a housing including a front plate, the rear plate facing an opposite direction to the front plate, and a side structure surrounding a space formed between the front plate and the rear plate, and a display. The rear plate includes a glass plate and decorative member, the decorative member including a first base plate, a second base plate, a first molding pattern disposed on the first base plate and including a 3-dimensional pattern, a first adhesive layer between the first molding pattern layer and the second base plate, wherein an index of refraction of the first adhesive layer is different from an index of refraction of the first molding pattern, and a shielding printing layer.

公开(公告)号：US20220408581A1

公开(公告)日：2022-12-22

申请号：US17896733

申请日：2022-08-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyoungdon SON ,  Poonggi JUNG ,  Sejin KIM ,  Hakju KIM ,  Jindeuk JEON

IPC: H05K5/03 ,  C03B23/03 ,  C03C17/00 ,  B24B29/00

Abstract: A rear cover of an electronic device is provided. The rear cover includes a glass substrate including a first face facing a first direction, a second face facing a second direction opposite to the first direction, and at least one side face disposed between the first face and the second face, a roughness layer formed on the first face and having a first roughness, a hairline pattern formed on the roughness layer and having a second roughness, and a hard coating layer formed on the roughness layer and the hairline pattern.

公开(公告)号：US20180361630A1

公开(公告)日：2018-12-20

申请号：US15959570

申请日：2018-04-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Min KIM ,  Yongha KIM ,  Hyun-Hee LEE ,  Minhyouk KIM ,  Seon-Jung KIM ,  Yuguen KIM ,  Hakju KIM ,  Seon KIM ,  Kyungtae BYUN

IPC: B29C43/02 ,  B29C43/52 ,  B29C35/08

Abstract: According to various embodiments, there may be provided a housing manufacturing method including preparing a base material, disposing at least one patterned structure layer including a plurality of fillers on an upper portion of the base material, and disposing a protective layer on an upper portion of the patterned structure layer. In addition, the housing manufactured by the aforementioned manufacturing method may be applied to at least part of an exterior of an electronic device.