公开(公告)号：US20180361630A1

公开(公告)日：2018-12-20

申请号：US15959570

申请日：2018-04-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Min KIM ,  Yongha KIM ,  Hyun-Hee LEE ,  Minhyouk KIM ,  Seon-Jung KIM ,  Yuguen KIM ,  Hakju KIM ,  Seon KIM ,  Kyungtae BYUN

IPC: B29C43/02 ,  B29C43/52 ,  B29C35/08

Abstract: According to various embodiments, there may be provided a housing manufacturing method including preparing a base material, disposing at least one patterned structure layer including a plurality of fillers on an upper portion of the base material, and disposing a protective layer on an upper portion of the patterned structure layer. In addition, the housing manufactured by the aforementioned manufacturing method may be applied to at least part of an exterior of an electronic device.