公开(公告)号：US20240318037A1

公开(公告)日：2024-09-26

申请号：US18609795

申请日：2024-03-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yearin Byun ,  Eunock Kim ,  Suyeong Jung ,  Hyungoo Kong ,  Inkwon Kim ,  Sanghyun Park

IPC: C09G1/02 ,  H01L21/3205 ,  H01L21/321

CPC classification number: C09G1/02 ,  H01L21/3212 ,  H01L21/32051

Abstract: The present disclosure relates to slurry compositions used for chemical mechanical polishing of a metal film. An example slurry composition includes abrasive particles, deionized water, and an oxidizer. The oxidizer includes iodine, and is a temperature-sensitive oxidizer capable of controlling both a static etch rate and a removal rate of the metal film when a polishing temperature during the chemical mechanical polishing is about 5° C. to about 100° C.