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公开(公告)号:US20240417593A1
公开(公告)日:2024-12-19
申请号:US18596020
申请日:2024-03-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Woosung Jeon , Yongtae Park , Doyoon Kim , Jaehoon Ryu , Sunjae Jang , Sungsik Jo
IPC: C09G1/02
Abstract: Provided is a slurry composition for chemical mechanical polishing (CMP) including an organic abrasive material that includes a supramolecular compound (e.g., supramolecular assembly), an analog thereof, or a derivative thereof. The slurry composition for chemical mechanical polishing may reduce or prevent CMP-induced defects, thereby reducing or suppressing product defects with a higher polishing selectivity.
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公开(公告)号:US11682717B2
公开(公告)日:2023-06-20
申请号:US17459527
申请日:2021-08-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yumin Kim , Doyoon Kim , Seyun Kim , Jinhong Kim , Soichiro Mizusaki , Youngjin Cho
IPC: H01L29/68 , H01L27/115
CPC classification number: H01L29/685 , H01L27/115
Abstract: Disclosed are a memory device including a vertical stack structure and a method of manufacturing the memory device. The memory device includes an insulating structure having a shape including a first surface and a protrusion portion protruding in a first direction from the first surface, a recording material layer covering the protrusion portion along a protruding shape of the protrusion portion and extending to the first surface on the insulating structure a channel layer on the recording material layer along a surface of the recording material layer, a gate insulating layer on the channel layer, and a gate electrode formed at a location on the gate insulating layer to face a second surface which is a protruding upper surface of the protrusion portion, wherein a void exists between the gate electrode and the insulating structure, defined by the insulating structure and the recording material layer.
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公开(公告)号:US10728958B2
公开(公告)日:2020-07-28
申请号:US15868451
申请日:2018-01-11
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seyun Kim , Jinhong Kim , Haengdeog Koh , Doyoon Kim , Hajin Kim , Soichiro Mizusaki , Minjong Bae , Changsoo Lee
Abstract: A The heating element structure includes: a conductive metal substrate; a heating layer spaced apart from the conductive metal substrate and configured to generate heat in response to an electrical signal; electrodes in contact with the heating layer and configured to provide the electrical signal to the heating layer; and a first insulating layer on the conductive metal substrate, the first insulating layer comprising a first matrix material and a particle, wherein a difference between a coefficient of thermal expansion (CTE) of the first matrix material and a coefficient of thermal expansion of the particle is about 4×10−6 per Kelvin or less.
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公开(公告)号:US09653501B2
公开(公告)日:2017-05-16
申请号:US15049658
申请日:2016-02-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jesada Ungnapatanin , Seokho Yun , Doyoon Kim
IPC: H01L31/0232 , H01L27/146
CPC classification number: H01L27/14621 , H01L27/14625 , H01L27/1463 , H01L27/14645 , H01L27/14685
Abstract: An image sensor including a color filter and a method of manufacturing the image sensor are provided. The image sensor includes a light-sensing layer configured to detect incident light, and convert the incident light to an electrical signal. The image sensor further includes a color filter layer disposed on the light-sensing layer, the color filter layer including color filters, each of the color filters being configured to transmit, among the incident light, light in a wavelength band to the light-sensing layer. The image sensor further includes an isolation layer disposed between the color filters, the isolation layer being configured to optically isolate the color filters from each other. An upper portion of each of the color filters has a cylindrical shape, and a lower portion of each of the color filters has a hemispherical shape.
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公开(公告)号:US10893578B2
公开(公告)日:2021-01-12
申请号:US16145753
申请日:2018-09-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Haengdeog Koh , Hajin Kim , Minjong Bae , Doyoon Kim , Seyun Kim , Jinhong Kim , Soichiro Mizusaki , Changsoo Lee
Abstract: A composition for forming a heating element; a dried and sintered product thereof; and a method of preparing the composition for forming a heating element, the composition including a matrix particle, a composite filler, and a solvent, wherein the composite filler includes a core and a coating layer disposed on the core, the core includes a nanosheet filler, and the composition has a pH in a range of about 5 to about 9.
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公开(公告)号:US20180168000A1
公开(公告)日:2018-06-14
申请号:US15836002
申请日:2017-12-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hiesang Sohn , Seyun Kim , Haengdeog Koh , Doyoon Kim , Soichiro Mizusaki , Jinhong Kim , Hajin Kim , Minjong Bae , Changsoo Lee
CPC classification number: H05B1/0263 , B29C70/025 , B29C70/88 , C03C4/14 , C03C8/14 , C03C8/16 , C03C14/004 , C03C17/007 , C03C17/008 , C03C2217/452 , C03C2217/48 , H05B3/14 , H05B3/141 , H05B3/146 , H05B3/26 , H05B2203/013
Abstract: A heating element includes a plurality of matrix particles and a conductive inorganic filler disposed at interfaces between the plurality of matrix particles to provide a conductive network.
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公开(公告)号:US12041697B2
公开(公告)日:2024-07-16
申请号:US16919792
申请日:2020-07-02
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hiesang Sohn , Seyun Kim , Haengdeog Koh , Doyoon Kim , Soichiro Mizusaki , Jinhong Kim , Hajin Kim , Minjong Bae , Changsoo Lee
IPC: H05B1/02 , B29C70/02 , B29C70/88 , C03C4/14 , C03C8/04 , C03C8/14 , C03C8/16 , C03C14/00 , C03C17/00 , H05B3/14 , H05B3/26
CPC classification number: H05B1/0263 , B29C70/025 , B29C70/88 , C03C4/14 , C03C8/04 , C03C8/14 , C03C8/16 , C03C14/004 , C03C17/007 , C03C17/008 , H05B3/14 , H05B3/141 , H05B3/146 , H05B3/26 , C03C2217/452 , C03C2217/48 , H05B2203/013
Abstract: A heating element includes a plurality of matrix particles and a conductive inorganic filler disposed at interfaces between the plurality of matrix particles to provide a conductive network.
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公开(公告)号:US20240165370A1
公开(公告)日:2024-05-23
申请号:US18490657
申请日:2023-10-19
Applicant: Samsung Electronics Co., Ltd.
Inventor: Vutha Va , Hao Chen , Doyoon Kim , Jianzhong Zhang , Joonhyun Lee
CPC classification number: A61M21/00 , A61B5/4809 , A61B5/4812 , A61B5/4815 , A61B5/7275 , G16H10/60
Abstract: An apparatus for monitoring sleep quality includes a plurality of sensors, a plurality of actuator modules, a transceiver, and a processor operatively coupled with the plurality of sensor modules, the plurality of actuator modules, and the transceiver. The processor is configured to monitor a sleep session of a user utilizing the apparatus. To monitor the sleep session, the processor is further configured to monitor a sleep state of the user, monitor a sleep stage of the user, and monitor a sleep condition. The processor is further configured to select a sleep facilitating action, control the sleep facilitating action based on the monitoring, and collect data related to the sleep session, and update a sleep history database associated with the user based on the data related to the sleep session.
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公开(公告)号:US11856873B2
公开(公告)日:2023-12-26
申请号:US17395040
申请日:2021-08-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Soichiro Mizusaki , Doyoon Kim , Seyun Kim , Yumin Kim , Jinhong Kim , Youngjin Cho
CPC classification number: H10N70/24 , H10B63/34 , H10B63/845 , H10N70/8833
Abstract: A variable resistance memory may include first and second conductive elements spaced apart from each other on a variable resistance layer. The variable resistance layer may include first to third oxide layers sequentially arranged in a direction perpendicular to a direction in which the first and second conductive elements are arranged. A dielectric constant of the second oxide layer may be greater than dielectric constants of the first and third oxide layers.
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公开(公告)号:US11162687B2
公开(公告)日:2021-11-02
申请号:US15633832
申请日:2017-06-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: Changsoo Lee , Doyoon Kim , Hajin Kim , Haengdeog Koh , Seyun Kim , Jinhong Kim , Taehun Kim , Soichiro Mizusaki , Minjong Bae , Hiesang Sohn , Kunwoo Choi
Abstract: A planar heating apparatus includes a substrate, first electrodes on the substrate, second electrodes alternately arranged with the first electrodes, an electrode connector connecting end portions of the first or second electrodes to each other and a power connector connected to the electrode connector and to which a power supply is connected. The power connector extends outside of the substrate.
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