公开(公告)号：US20200335460A1

公开(公告)日：2020-10-22

申请号：US16916381

申请日：2020-06-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doo Hwan LEE ,  Jong Rip Kim ,  Hyoung Joon Kim ,  Jin Yul Kim ,  Kyung Seob OH

IPC: H01L23/00 ,  H05K1/18 ,  H01L23/498 ,  H05K3/46 ,  H01L23/31 ,  H01L23/538

Abstract: A semiconductor package includes a semiconductor chip, an encapsulant, and an interconnection member. The semiconductor chip has connection pads. The encapsulant encapsulates a portion of the semiconductor chip. The interconnection member includes a first insulating layer disposed on the encapsulant and a portion of the semiconductor chip, a redistribution layer disposed on the first insulating layer, and a second insulating layer disposed on the first insulating layer and the redistribution layer. The redistribution layer is electrically connected to the connection pads of the semiconductor chip, and a thickness of the second insulating layer is greater than a thickness of the first insulating layer.

公开(公告)号：US20200075492A1

公开(公告)日：2020-03-05

申请号：US16216946

申请日：2018-12-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joo Young CHOI ,  Doo Hwan LEE ,  Da Hee KIM ,  Jae Hoon CHOI ,  Byung Ho KIM

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor package includes a connection member having a first surface and a second surface opposing each other and including a first redistribution layer on the second surface and at least one second redistribution layer on a level different from a level of the first redistribution layer; a semiconductor chip on the first surface of the connection member; a passivation layer on the second surface of the connection member, and including openings; UBM layers connected to the first redistribution layer through the openings; and electrical connection structures on UBM layers. An interface between the passivation layer and the UBM layers has a first unevenness surface, an interface between the passivation layer and the first redistribution layer has a second unevenness surface, connected to the first unevenness surface, and the second unevenness surface has a surface roughness greater than a surface roughness of the second redistribution layer.

公开(公告)号：US20200066613A1

公开(公告)日：2020-02-27

申请号：US16211928

申请日：2018-12-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doo Hwan LEE ,  Tae Je CHO

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor package includes: a semiconductor chip having an active surface, having connection pads disposed thereon, and an inactive surface, opposing the active surface; an encapsulant covering the inactive surface of the semiconductor chip; a thermally conductive via penetrating through at least a portion of the encapsulant on the inactive surface of the semiconductor chip and physically spaced apart from the inactive surface of the semiconductor chip; and a connection structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads.