公开(公告)号：US20200075492A1

公开(公告)日：2020-03-05

申请号：US16216946

申请日：2018-12-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joo Young CHOI ,  Doo Hwan LEE ,  Da Hee KIM ,  Jae Hoon CHOI ,  Byung Ho KIM

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor package includes a connection member having a first surface and a second surface opposing each other and including a first redistribution layer on the second surface and at least one second redistribution layer on a level different from a level of the first redistribution layer; a semiconductor chip on the first surface of the connection member; a passivation layer on the second surface of the connection member, and including openings; UBM layers connected to the first redistribution layer through the openings; and electrical connection structures on UBM layers. An interface between the passivation layer and the UBM layers has a first unevenness surface, an interface between the passivation layer and the first redistribution layer has a second unevenness surface, connected to the first unevenness surface, and the second unevenness surface has a surface roughness greater than a surface roughness of the second redistribution layer.