公开(公告)号：US10892227B2

公开(公告)日：2021-01-12

申请号：US15441655

申请日：2017-02-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyoung Joon Kim ,  Doo Hwan Lee

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/16 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L23/14

Abstract: A fan-out semiconductor package is provided. A semiconductor chip is disposed in a through hole of a first connection member. At least a portion of the semiconductor chip is encapsulated by an encapsulant. A second connection member including a redistribution layer is formed on an active surface of the semiconductor chip. An external connection terminal having excellent reliability is formed on the encapsulant.

公开(公告)号：US10741461B2

公开(公告)日：2020-08-11

申请号：US16036209

申请日：2018-07-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyoung Joon Kim ,  Kyung Seob Oh ,  Kyoung Moo Harr

IPC: H01L23/22 ,  H01L23/053 ,  H01L23/24 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L23/498

Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole, having an active surface having a connection pad disposed thereon and an inactive surface opposing the active surface, and having a protrusion bump disposed on the connection pad; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; and a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip. In the fan-out semiconductor package, step portions of the protrusion bumps may be removed.

公开(公告)号：US10886230B2

公开(公告)日：2021-01-05

申请号：US15716301

申请日：2017-09-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyoung Joon Kim ,  Doo Hwan Lee

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/16 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L23/14

Abstract: A fan-out semiconductor package is provided. A semiconductor chip is disposed in a through hole of a first connection member. At least a portion of the semiconductor chip is encapsulated by an encapsulant. A second connection member including a redistribution layer is formed on an active surface of the semiconductor chip. An external connection terminal having excellent reliability is formed on the encapsulant.

公开(公告)号：US10566289B2

公开(公告)日：2020-02-18

申请号：US15286253

申请日：2016-10-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doo Hwan Lee ,  Kyung Seob Oh ,  Jong Rip Kim ,  Hyoung Joon Kim

IPC: H01L23/538 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L21/683 ,  H01L23/29

Abstract: A fan-out semiconductor package may include: a first connection member having a through hole; a semiconductor chip disposed in the through hole and having an active surface on which a connection pad is disposed and a non-active surface opposing the active surface; an encapsulant at least partially encapsulating the first connection member and the non-active surface of the semiconductor chip; and a second connection member disposed on the first connection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad, wherein the first connection member includes a first insulating layer, a first redistribution layer embedded in the first insulating layer while contacting the second connection member, and a second redistribution layer disposed on the other side of the first insulating layer opposing one side thereof in which the first redistribution layer is embedded.

公开(公告)号：US11011482B2

公开(公告)日：2021-05-18

申请号：US16916381

申请日：2020-06-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doo Hwan Lee ,  Jong Rip Kim ,  Hyoung Joon Kim ,  Jin Yul Kim ,  Kyung Seob Oh

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L23/538 ,  H05K1/18 ,  H05K3/46

Abstract: A semiconductor package includes a semiconductor chip, an encapsulant, and an interconnection member. The semiconductor chip has connection pads. The encapsulant encapsulates a portion of the semiconductor chip. The interconnection member includes a first insulating layer disposed on the encapsulant and a portion of the semiconductor chip, a redistribution layer disposed on the first insulating layer, and a second insulating layer disposed on the first insulating layer and the redistribution layer. The redistribution layer is electrically connected to the connection pads of the semiconductor chip, and a thickness of the second insulating layer is greater than a thickness of the first insulating layer.

公开(公告)号：US10818621B2

公开(公告)日：2020-10-27

申请号：US15381635

申请日：2016-12-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doo Hwan Lee ,  Hyoung Joon Kim ,  Dae Jung Byun

IPC: H01L23/00 ,  H01L23/31

Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface and an inactive surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip; a passivation layer disposed on the second interconnection member; and an under-bump metal layer including an external connection pad formed on the passivation layer and a plurality of vias connecting the external connection pad and the redistribution layer of the second interconnection member to each other, wherein the first interconnection member includes a redistribution layer electrically connected to the connection pads of the semiconductor chip.

公开(公告)号：US10600748B2

公开(公告)日：2020-03-24

申请号：US15377402

申请日：2016-12-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doo Hwan Lee ,  Jong Rip Kim ,  Hyoung Joon Kim ,  Jin Yul Kim ,  Kyung Seob Oh

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H05K1/18 ,  H01L23/498 ,  H05K3/46

Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip; and a passivation layer disposed on the second interconnection member. The first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pads of the semiconductor chip, the second interconnection member includes an insulating layer on which the redistribution layer of the second interconnection member is disposed, and the passivation layer has a modulus of elasticity greater than that of the insulating layer of the second interconnection member.

公开(公告)号：US20200335460A1

公开(公告)日：2020-10-22

申请号：US16916381

申请日：2020-06-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doo Hwan LEE ,  Jong Rip Kim ,  Hyoung Joon Kim ,  Jin Yul Kim ,  Kyung Seob OH

IPC: H01L23/00 ,  H05K1/18 ,  H01L23/498 ,  H05K3/46 ,  H01L23/31 ,  H01L23/538

Abstract: A semiconductor package includes a semiconductor chip, an encapsulant, and an interconnection member. The semiconductor chip has connection pads. The encapsulant encapsulates a portion of the semiconductor chip. The interconnection member includes a first insulating layer disposed on the encapsulant and a portion of the semiconductor chip, a redistribution layer disposed on the first insulating layer, and a second insulating layer disposed on the first insulating layer and the redistribution layer. The redistribution layer is electrically connected to the connection pads of the semiconductor chip, and a thickness of the second insulating layer is greater than a thickness of the first insulating layer.

公开(公告)号：US10714437B2

公开(公告)日：2020-07-14

申请号：US15905062

申请日：2018-02-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doo Hwan Lee ,  Jong Rip Kim ,  Hyoung Joon Kim ,  Jin Yul Kim ,  Kyung Seob Oh

IPC: H05K1/18 ,  H05K3/46 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538

Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip; and a passivation layer disposed on the second interconnection member. The first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pads of the semiconductor chip, the second interconnection member includes an insulating layer on which the redistribution layer of the second interconnection member is disposed, and the passivation layer has a modulus of elasticity greater than that of the insulating layer of the second interconnection member.