公开(公告)号：US10747123B2

公开(公告)日：2020-08-18

申请号：US16196626

申请日：2018-11-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tae-sun Kim ,  Young-sik Park ,  Min-keun Kwak ,  Byoung-hoon Kim ,  Yong-chul Kim ,  Hyun-jeong Lee ,  Sung-won Choi

IPC: G03F7/20 ,  G06T7/00 ,  H01L23/544 ,  H01L21/68 ,  G01N21/95 ,  G01N21/956

Abstract: A semiconductor device includes a semiconductor substrate including an in-cell area and a scribe lane defining the in-cell area, a first overlay pattern on the semiconductor substrate, and a second overlay pattern adjacent to the first overlay pattern, wherein the first overlay pattern is a diffraction-based overlay (DBO) pattern and the second overlay pattern is a scanning electron microscope (SEM) overlay pattern.