公开(公告)号：US20170365572A1

公开(公告)日：2017-12-21

申请号：US15451880

申请日：2017-03-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Doo Hwan LEE ,  Ju Hyeon KIM ,  Dae Kyu AHN ,  Sung Won JEONG

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L24/20 ,  H01L21/486 ,  H01L21/568 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/04 ,  H01L24/13 ,  H01L24/19 ,  H01L2224/02373 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/2101 ,  H01L2224/214 ,  H01L2224/221 ,  H01L2224/96 ,  H01L2924/3511

Abstract: A fan-out semiconductor package includes a first connection member having a through hole, a semiconductor chip in the through hole, having an active surface with a connection pad and an inactive surface on an opposing side. An encapsulant encapsulates at least a portion of the first connection member and the semiconductor chip. A second connection member is on the first connection member and the semiconductor chip. The first connection member and the second connection member each include a redistribution layer electrically connected to a connection pad of the semiconductor chip. The interface between the second connection member and the encapsulant is located on a different level from the level of the interface between the second connection member and a redistribution layer of the first connection member or the level of the interface between the second connection member and a connection pad of the semiconductor chip.

公开(公告)号：US20190164862A1

公开(公告)日：2019-05-30

申请号：US15988610

申请日：2018-05-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ju Hyeon KIM ,  Doo Hwan LEE

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498

Abstract: A semiconductor package includes: a core member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip. A wall of the through-hole has an uneven portion.

公开(公告)号：US20180082962A1

公开(公告)日：2018-03-22

申请号：US15459322

申请日：2017-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Doo Hwan LEE ,  Ju Hyeon KIM ,  Hyoung Joon KIM ,  Joon Sung KIM

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L24/02 ,  H01L23/3128 ,  H01L23/3171 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/02331 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/02379

Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; and a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip. The first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pads of the semiconductor chip, and the encapsulant fills spaces between walls of the through-hole and side surfaces of the semiconductor chip, and at least portions of the encapsulant extend to a space between the first interconnection member and the second interconnection member and a space between the active surface of the semiconductor chip and the second interconnection member.