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公开(公告)号：US20150373833A1
公开(公告)日：2015-12-24
申请号：US14488225
申请日：2014-09-16
发明人： Yong Ho BAEK , Hyo Seung Nam , Jae Hoon Choi , Eung Suek Lee , Jeong Ho Lee
CPC分类号： H05K3/4682 , H05K3/0097 , H05K3/4673 , H05K2201/096 , H05K2203/1536 , Y10T29/49156
摘要： There are provided a printed circuit board and a method of manufacturing the same. According to an exemplary embodiment of the present disclosure, a printed circuit board includes: an insulating layer; a first outer layer circuit pattern formed in a lower portion of the insulating layer to be embedded in the insulating layer; and a second outer layer circuit pattern formed on the insulating layer to protrude from the insulating layer.
摘要翻译： 提供了一种印刷电路板及其制造方法。 根据本公开的示例性实施例，印刷电路板包括：绝缘层; 第一外层电路图形，形成在所述绝缘层的下部，以嵌入所述绝缘层中; 以及形成在所述绝缘层上以从所述绝缘层突出的第二外层电路图案。
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公开(公告)号：US09673066B2
公开(公告)日：2017-06-06
申请号：US14987490
申请日：2016-01-04
发明人： No Il Park , Seung Wook Park , Eung Suek Lee , Tae Sung Jeong
IPC分类号： H01L21/56 , H01L21/67 , H01L25/00 , H01L25/065 , H01L23/31
CPC分类号： H01L21/565 , H01L21/566 , H01L21/67126 , H01L23/3142 , H01L25/0655 , H01L25/50 , H01L2224/16227 , H01L2924/1815
摘要： An apparatus for manufacturing a semiconductor package module and a method of manufacturing a semiconductor package are provided. The apparatus for manufacturing a semiconductor package module includes a lower mold installed thereon with a board with at least one element mounted thereon, an upper mold, in a state of accommodating the board, provided above the board, a filler supplier disposed in at least one of the upper mold and the lower mold, and supplying a filler to a molding space between the board and the upper mold, and a pattern forming member provided in an inner surface of the upper mold that provides an uneven pattern on a molded part.
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公开(公告)号：US09837343B2
公开(公告)日：2017-12-05
申请号：US14754363
申请日：2015-06-29
发明人： Joon Sung Kim , Yong Ho Baek , Jung Hyun Cho , Eung Suek Lee , Jae Hoon Choi , Young Gwan Ko
IPC分类号： H05K1/18 , H01L23/498 , H01L21/48 , H01L23/538 , H01L23/00 , H05K3/46 , H01L23/13 , H05K3/30
CPC分类号： H01L23/49827 , H01L21/4846 , H01L23/13 , H01L23/5389 , H01L24/25 , H01L24/82 , H01L2224/04105 , H01L2224/19 , H01L2224/2518 , H01L2224/32225 , H01L2224/83005 , H01L2224/92144 , H01L2924/14 , H01L2924/15153 , H01L2924/3511 , H05K1/0298 , H05K1/185 , H05K3/10 , H05K3/30 , H05K3/305 , H05K3/4602 , H05K3/4644 , H05K2201/09227 , H05K2203/1469 , H05K2203/167
摘要： A chip embedded substrate includes: an insulating layer having outer layer circuit patterns provided on any one of an upper surface and a lower surface thereof; a chip embedded in the insulating layer; and internal circuit patterns included in the insulating layer and disposed between a height of a top surface of the chip and a height of a bottom surface thereof.
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公开(公告)号：US20150129289A1
公开(公告)日：2015-05-14
申请号：US14536384
申请日：2014-11-07
发明人： Gun Woo Kim , Eung Suek Lee , Yoong Oh , Sung Uk Lee
CPC分类号： H05K3/182 , H05K3/06 , H05K3/184 , H05K2203/0557 , H05K2203/1105 , H05K2203/1344
摘要： There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes: a substrate; a metal root layer formed by injecting and depositing metal particles into and on the substrate; and a circuit layer formed on the metal root layer.
摘要翻译： 提供了一种印刷电路板及其制造方法。 根据本公开的示例性实施例的印刷电路板包括：基板; 通过将金属颗粒注入并沉积在基底上而形成的金属根层; 以及形成在金属根层上的电路层。
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