公开(公告)号：US09911666B2

公开(公告)日：2018-03-06

申请号：US15036011

申请日：2014-11-10

申请人： SAEDGE VISION SOLUTIONS PTE. LTD.

发明人： Ah Kow Chin ,  Choong Fatt Ho ,  Victor Vertoprakhov ,  Soon Wei Wong

IPC分类号： G01N21/00 ,  H01L21/66 ,  H01L23/00 ,  G01N21/88 ,  G01N21/952 ,  H01L21/67 ,  G01N21/95

CPC分类号： H01L22/14 ,  G01N21/8851 ,  G01N21/95 ,  G01N21/9501 ,  G01N21/952 ,  H01L21/67288 ,  H01L22/12 ,  H01L24/48 ,  H01L2224/48 ,  H01L2224/4809 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2924/00012

摘要： There is provided an apparatus and method for inspecting a semiconductor package. The apparatus includes at least one 3D camera positioned at a first angle relative to a normal axis of the semiconductor package; and a light source configured to provide illumination for the at least one 3D camera, the light source being directed at the semiconductor package. The method includes casting a shadow of a bonded wire onto the semiconductor package; obtaining a 3D image of the semiconductor package; determining a distance S of the shadow and the bonded wire in the image; and obtaining a wire loop height H of the bonded wire.