公开(公告)号：US10514132B2

公开(公告)日：2019-12-24

申请号：US15752944

申请日：2016-08-24

Applicant: SABIC Global Technologies B.V.

Inventor： Yingjun Cheng ,  Andries Jakobus Petrus Van Zyl ,  Libo Wu

IPC: F21K9/232 ,  C09K11/02 ,  H05B33/14 ,  F21K9/27 ,  C09K11/08 ,  F21K9/66 ,  F21K9/275 ,  F21K9/238 ,  F21K9/237 ,  H01L33/06 ,  H01L33/62 ,  H01L51/50 ,  F21Y115/00 ,  F21Y105/00 ,  F21Y115/10 ,  F21Y105/10

Abstract: A lighting apparatus includes a housing, an electroluminescent quantum dots (QD) unit as a light source, and an electrical component for providing electrical energy to the electroluminescent QD unit. The housing may be in the form of an incandescent bulb, a halogen bulb, a fluorescent tube or a panel. The electroluminescent QD unit includes a plurality of QDs printed on an insulating substrate. The substrate may be flexible so that the electroluminescent QD unit may be bent or curved to conform to the shape of an incandescent bulb, fluorescent tube or panel or a halogen filament so as to mimic these traditional light sources. Methods for retrofitting traditional or LED light fixtures with a lighting apparatus including an electroluminescent quantum dots (QD) unit as a light source are also described.

公开(公告)号：US20190036082A1

公开(公告)日：2019-01-31

申请号：US16073532

申请日：2017-01-27

Applicant: SABIC Global Technologies B.V.

Inventor： Yingjun Cheng ,  Libo Wu ,  Andries Jakobus Petrus van Zyl ,  Wei Feng

IPC: H01L51/52 ,  H01L51/00 ,  H01L51/56

Abstract: An integrated substrate includes a substrate having a first surface and a second surface, and a light extraction layer disposed on the first surface of the substrate. The light extraction layer includes a polyimide having a glass transition temperature of greater than 200 to 350° C., and a plurality of nanoparticles, and the light extraction layer has a refractive index of 1.7 to 2.0. A method of manufacturing the integrated substrate is also disclosed, where the method includes applying the light extraction layer on the first surface of the substrate. An optical device including the integrated substrate is also described.