公开(公告)号：US20120138336A1

公开(公告)日：2012-06-07

申请号：US13091074

申请日：2011-04-20

申请人： Ryoichi WATANABE ,  Going Sik KIM ,  Chang Sup RYU

发明人： Ryoichi WATANABE ,  Going Sik KIM ,  Chang Sup RYU

IPC分类号： H05K1/02 ,  B05D5/12

CPC分类号： H05K3/107 ,  H01L2224/05557 ,  H05K3/108 ,  H05K3/381

摘要： Disclosed herein is a printed circuit board and a method of manufacturing the same, in which a circuit pattern one end of which is embedded in a trench and the other end of which protrudes from an insulating layer is formed, so that the circuit pattern is not easily separated from the insulating layer and the separation problems of the circuit pattern due to undercutting are solved. Also, the adhesion between the insulating layer and the circuit pattern is enhanced, more stably forming a fine circuit pattern. Even when a plating resist is formed thin, it is possible to form the circuit pattern, resulting in a high-solution circuit pattern.

摘要翻译： 这里公开了一种印刷电路板及其制造方法，其中形成其一端嵌入沟槽中的电路图案，其另一端从绝缘层突出，使得电路图案不是 容易地与绝缘层分离，并且解决了由于底切引起的电路图案的分离问题。 此外，增强了绝缘层和电路图案之间的粘合性，更稳定地形成精细电路图案。 即使电镀抗蚀剂形成得较薄，也可形成电路图案，形成高溶液电路图形。

公开(公告)号：US20120077333A1

公开(公告)日：2012-03-29

申请号：US13310319

申请日：2011-12-02

申请人： Young Gwan KO ,  Ryoichi WATANABE ,  Sang Soo LEE

发明人： Young Gwan KO ,  Ryoichi WATANABE ,  Sang Soo LEE

IPC分类号： H01L21/78

CPC分类号： H01L21/486 ,  H01L21/32115 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/045 ,  H05K3/06 ,  H05K3/465 ,  H05K2201/09036 ,  H05K2201/09781 ,  H05K2203/0723 ,  H01L2924/00

摘要： Disclosed herein are a trench substrate and a method of manufacturing the same. The trench substrate includes a base substrate, an insulating layer formed on one side or both sides of the base substrate and including trenches formed in a circuit region and a dummy region positioned at a peripheral edge of the trench substrate, and a circuit layer formed in the trenches of the circuit region through a plating process and including a circuit pattern and vias. Thanks to formation of the trenches in the dummy region and the cutting region, deviation in thickness of a plating layer formed on the insulating layer in a plating process is improved upon.

摘要翻译： 这里公开了沟槽衬底及其制造方法。 沟槽基板包括基底基板，形成在基底基板的一侧或两侧上的绝缘层，并且包括形成在电路区域中的沟槽和位于沟槽基板的周边边缘的虚设区域，以及电路层， 通过电镀工艺的电路区域的沟槽，并且包括电路图案和通孔。 由于在虚拟区域和切割区域中形成沟槽，因此在电镀工艺中在绝缘层上形成的镀层的厚度偏差得到改善。