公开(公告)号：US06472251B1

公开(公告)日：2002-10-29

申请号：US09829208

申请日：2001-04-09

申请人： Ronald D. Myer ,  David J. Post ,  Bradley R. Knigga ,  Paul C. Staab

发明人： Ronald D. Myer ,  David J. Post ,  Bradley R. Knigga ,  Paul C. Staab

IPC分类号： H01L2144

CPC分类号： H01L23/047 ,  H01L21/50 ,  H01L23/24 ,  H01L24/97 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  Y10T83/0605 ,  Y10T83/159 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of fabricating a microelectronic device package is provided. The method includes a continuous processing mode of microelectronic device packages wherein process steps for fabricating the microelectronic device package are performed resulting in savings from the removal of more expensive batch processing steps.

摘要翻译： 提供一种制造微电子器件封装的方法。 该方法包括微电子器件封装的连续处理模式，其中执行用于制造微电子器件封装的工艺步骤，从而节省从更昂贵的批处理步骤的去除。

公开(公告)号：US20170173545A1

公开(公告)日：2017-06-22

申请号：US14977738

申请日：2015-12-22

申请人： Ronald D. Myer

发明人： Ronald D. Myer

IPC分类号： B01F9/00

CPC分类号： B01F9/0016 ,  B01F9/003 ,  B01F2009/0059

摘要： A device for mixing a substance within a container. A mixer includes a motor driven roller positioned between a pair of rods. A cylindrical tube is removably mounted against the roller and is rotatable therewith with the rods limiting sideways motion. The containers holding the materials to be mixed are inserted into the tube and rotated therewith. A frame is provided to hold multiple mixers.

公开(公告)号：US5492263A

公开(公告)日：1996-02-20

申请号：US250758

申请日：1994-05-26

申请人： Mark E. Webster ,  John A. Hearn ,  Daniel R. Bellus ,  Steven M. Stansberry ,  Steven A. Middleton ,  Ronald D. Myer ,  Gregory L. Hall

发明人： Mark E. Webster ,  John A. Hearn ,  Daniel R. Bellus ,  Steven M. Stansberry ,  Steven A. Middleton ,  Ronald D. Myer ,  Gregory L. Hall

IPC分类号： B23K20/00 ,  B23K20/10

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K20/10 ,  H01L24/48 ,  B23K2201/36 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/20752 ,  H01L2924/2076 ,  Y10T428/1275

摘要： A method is provided for wire bonding an aluminum wire to a surface of a lead of an electronics package. The method entails a nickel plating process and an ultrasonic bonding process which together cooperate to form a reliable and highly repeatable joint between the wire and the lead member. The ultrasonic bonding process is specifically tailored to the nickel plating produced by the plating process, so as to significantly enhance the bond strength of the resulting ultrasonic bond joint. The plating process is devised to produce a nickel plating which is thicker than that generally practiced, and whose surface is characterized as having a relatively smooth microfinish which unexpectedly serves to enhance the bond strength of the ultrasonic bond joint.

摘要翻译： 提供了一种用于将铝线引线连接到电子封装的引线的表面的方法。 该方法需要镍电镀工艺和超声波接合工艺，它们一起协作以在电线和引线部件之间形成可靠和高度可重复的接头。 超声波接合工艺专门针对通过电镀工艺生产的镀镍，以显着提高所得超声波接合接头的结合强度。 电镀工艺被设计成产生比通常实施的更厚的镍电镀，其表面的特征在于具有相对平滑的微精加工，其意外地用于增强超声波接合接头的结合强度。