公开(公告)号：US10569383B2

公开(公告)日：2020-02-25

申请号：US15705561

申请日：2017-09-15

申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc.

发明人： Stephen G. Pisklak ,  Jeffrey James Hendron

IPC分类号： B24B37/013 ,  B24B37/24 ,  B24B37/26 ,  B24B37/20 ,  B24D18/00 ,  B24B37/22

摘要： The present invention provides a chemical mechanical (CMP) polishing pad with a top surface, one or more apertures adapted to receive an endpoint detection window, an underside having a recessed portion and having one or more flanged endpoint detection windows (windows), each window having a flange adapted to fit snugly into the recessed portion of the underside of the polishing layer, the flange having a thickness slightly less than the depth of the recessed portion of the polishing layer (to allow for adhesive), having a detection area that fits snugly into an aperture in the polishing layer so that its top surface that lies substantially flush with the top surface of the polishing layer.

公开(公告)号：US20190084120A1

公开(公告)日：2019-03-21

申请号：US15705561

申请日：2017-09-15

申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc.

发明人： Stephen G. Pisklak ,  Jeffrey James Hendron

IPC分类号： B24B37/20 ,  B24B37/013 ,  G01B11/06

摘要： The present invention provides a chemical mechanical (CMP) polishing pad with a top surface, one or more apertures adapted to receive an endpoint detection window, an underside having a recessed portion and having one or more flanged endpoint detection windows (windows), each window having a flange adapted to fit snugly into the recessed portion of the underside of the polishing layer, the flange having a thickness slightly less than the depth of the recessed portion of the polishing layer (to allow for adhesive), having a detection area that fits snugly into an aperture in the polishing layer so that its top surface that lies substantially flush with the top surface of the polishing layer.