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公开(公告)号：US20120046388A1
公开(公告)日：2012-02-23
申请号：US13266476
申请日：2010-05-14
申请人： Roger Tietze , Yen-Loan Nguyen , Mark Bryant
发明人： Roger Tietze , Yen-Loan Nguyen , Mark Bryant
CPC分类号： C07D265/16 , C08G59/24 , C08G59/4014 , C08J5/04 , C08J2363/00 , C08J2379/04 , C08K7/02
摘要： The present invention provides a liquid resin system including a liquid monobenzoxazine monomer and a non-glycidyl epoxy compound, wherein the weight ratio of the monobenzoxazine monomer to the non-glycidyl epoxy compound is in a range of about 25:75 to about 60:40. The liquid resin system exhibits a low viscosity and exceptional stability over an extended period of time making its use in a variety of composite manufacturing methods highly advantageous.
摘要翻译： 本发明提供一种包含液体单苯并恶嗪单体和非缩水甘油基环氧化合物的液体树脂体系，其中单苯并恶嗪单体与非缩水甘油基环氧化合物的重量比在约25:75至约60:40的范围内 。 液体树脂体系在更长的时间内表现出低粘度和卓越的稳定性，使其在各种复合制造方法中的使用非常有利。
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2.发明授权Halogen-free benzoxazine based curable compositions for high TG applications 有权用于高TG应用的无卤素苯并恶嗪类可固化组合物公开(公告)号：US08975318B2
公开(公告)日：2015-03-10
申请号：US12918433
申请日：2009-02-20
申请人： Roger Tietze , Yen-Loan Nguyen
发明人： Roger Tietze , Yen-Loan Nguyen
IPC分类号： C08G73/02 , C08K5/357 , C08G59/24 , C08G59/40 , C08G59/50 , C08G59/62 , C08G59/68 , C08L63/00 , C08G59/06 , C08L75/08
CPC分类号： C08L79/04 , B29C65/02 , B29D22/003 , B29K2079/00 , C08G59/06 , C08G59/24 , C08G59/4014 , C08G59/5046 , C08G59/621 , C08G59/683 , C08G73/0233 , C08G2650/36 , C08K5/357 , C08L63/00 , C08L75/04 , C08L75/08 , Y10T428/1397 , C08L21/00
摘要： The present invention provides a halogen-free curable composition including a benzoxazine monomer, at least one epoxy resin, a catalyst, a toughening agent and a solvent. The halogen-free curable composition is especially suited for use in automobile and aerospace applications since the composition, upon curing, produces a composite having a high glass transition temperature.
摘要翻译： 本发明提供了包含苯并恶嗪单体，至少一种环氧树脂，催化剂，增韧剂和溶剂的无卤素可固化组合物。 无卤素可固化组合物特别适用于汽车和航空航天应用，因为组合物在固化后产生具有高玻璃化转变温度的复合材料。
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公开(公告)号：US08853302B2
公开(公告)日：2014-10-07
申请号：US13266476
申请日：2010-05-14
申请人： Roger Tietze , Yen-Loan Nguyen , Mark Bryant
发明人： Roger Tietze , Yen-Loan Nguyen , Mark Bryant
IPC分类号： C08L79/00 , C08L63/00 , C08G73/00 , C08G59/00 , B29C45/14 , C08G59/40 , C08G59/24 , C08J5/04 , C07D265/16 , C08K7/02
CPC分类号： C07D265/16 , C08G59/24 , C08G59/4014 , C08J5/04 , C08J2363/00 , C08J2379/04 , C08K7/02
摘要： The present invention provides a liquid resin system including a liquid monobenzoxazine monomer and a non-glycidyl epoxy compound, wherein the weight ratio of the monobenzoxazine monomer to the non-glycidyl epoxy compound is in a range of about 25:75 to about 60:40. The liquid resin system exhibits a low viscosity and exceptional stability over an extended period of time making its use in a variety of composite manufacturing methods highly advantageous.
摘要翻译： 本发明提供一种包含液体单苯并恶嗪单体和非缩水甘油基环氧化合物的液体树脂体系，其中单苯并恶嗪单体与非缩水甘油基环氧化合物的重量比在约25:75至约60:40的范围内 。 液体树脂体系在更长的时间内表现出低粘度和卓越的稳定性，使其在各种复合制造方法中的使用非常有利。
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4.发明申请Halogen Free Thermoset Resin System for Low Dielectric Loss at High Frequency Applications 审中-公开无卤热固性树脂系统，用于高频应用中的低介质损耗公开(公告)号：US20140057086A1
公开(公告)日：2014-02-27
申请号：US14110522
申请日：2012-05-09
申请人： Roger Tietze , Yen-Loan Nguyen
发明人： Roger Tietze , Yen-Loan Nguyen
CPC分类号： C08L71/08 , B32B27/32 , C08F216/1416 , C08F222/40 , C09J4/00 , H05K1/0366 , Y10T428/2481 , Y10T428/31681 , Y10T442/20 , Y10T442/2926 , Y10T442/2992
摘要： The present disclosure provides a thermosetting resin composition including a polymaleimide prepolymer and a poly(arylene ether) prepolymer characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards, semiconductor devices and radome composites for aerospace applications.
摘要翻译： 本公开内容提供了包含聚马来酰亚胺预聚物和聚（亚芳基醚）预聚物的热固性树脂组合物，其特征在于通过固化所述热固性树脂组合物形成的所得固化产物在高频下具有高耐热性和低介电损耗。 热固性树脂组合物特别适用于航空应用的高速印刷电路板，半导体器件和天线罩组合物。
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公开(公告)号：US20120003892A1
公开(公告)日：2012-01-05
申请号：US13256269
申请日：2010-03-16
申请人： Roger Tietze , Yen-Loan Nguyen
发明人： Roger Tietze , Yen-Loan Nguyen
IPC分类号： B32B27/04 , C09D7/12 , C09D135/06
CPC分类号： C09D179/085 , C08F22/40 , H05K1/0346 , Y10T442/2574
摘要： The present invention relates to a phosphoric acid resistant advanced polymaleimide prepolymer composition including a polymaleimide prepolymer resulting from the advancement reaction of a polyimide and an alkenylphenol, alkenylphenol ether or mixture thereof in the presence of an amine catalyst; a solvent and a heteropolyacid. The phosphoric acid resistant advanced polymaleimide prepolymer composition may be used in various applications such as prepregs, laminates, printed circuit boards, castings, composites, moulded articles, adhesives and coatings.
摘要翻译： 本发明涉及一种含磷酸的高级聚马来酰亚胺预聚物组合物，其包含由胺催化剂存在下由聚酰亚胺和链烯基酚，烯基苯酚醚或其混合物进行反应得到的聚马来酰亚胺预聚物; 溶剂和杂多酸。 耐磷酸的高级聚马来酰亚胺预聚物组合物可用于各种应用中，例如预浸料，层压板，印刷电路板，铸件，复合材料，模塑制品，粘合剂和涂料。
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公开(公告)号：US08445699B2
公开(公告)日：2013-05-21
申请号：US13256269
申请日：2010-03-16
申请人： Roger Tietze , Yen-Loan Nguyen
发明人： Roger Tietze , Yen-Loan Nguyen
IPC分类号： C07D207/452
CPC分类号： C09D179/085 , C08F22/40 , H05K1/0346 , Y10T442/2574
摘要： The present invention relates to a phosphoric acid resistant advanced polymaleimide prepolymer composition including a polymaleimide prepolymer resulting from the advancement reaction of a polyimide and an alkenylphenol, alkenylphenol ether or mixture thereof in the presence of an amine catalyst; a solvent and a heteropolyacid. The phosphoric acid resistant advanced polymaleimide prepolymer composition may be used in various applications such as prepregs, laminates, printed circuit boards, castings, composites, moulded articles, adhesives and coatings.
摘要翻译： 本发明涉及一种含磷酸的高级聚马来酰亚胺预聚物组合物，其包含由胺催化剂存在下由聚酰亚胺和链烯基酚，烯基苯酚醚或其混合物进行反应得到的聚马来酰亚胺预聚物; 溶剂和杂多酸。 耐磷酸的高级聚马来酰亚胺预聚物组合物可用于各种应用中，例如预浸料，层压板，印刷电路板，铸件，复合材料，模塑制品，粘合剂和涂料。
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7.发明申请HALOGEN-FREE BENZOXAZINE BASED CURABLE COMPOSITIONS FOR HIGH TG APPLICATIONS 有权用于高TG应用的无卤苯并噻唑基可固化组合物公开(公告)号：US20100330287A1
公开(公告)日：2010-12-30
申请号：US12918433
申请日：2009-02-20
申请人： Roger Tietze , Yen-Loan Nguyen
发明人： Roger Tietze , Yen-Loan Nguyen
CPC分类号： C08L79/04 , B29C65/02 , B29D22/003 , B29K2079/00 , C08G59/06 , C08G59/24 , C08G59/4014 , C08G59/5046 , C08G59/621 , C08G59/683 , C08G73/0233 , C08G2650/36 , C08K5/357 , C08L63/00 , C08L75/04 , C08L75/08 , Y10T428/1397 , C08L21/00
摘要： The present invention provides a halogen-free curable composition including a benzoxazine monomer, at least one epoxy resin, a catalyst, a toughening agent and a solvent. The halogen-free curable composition is especially suited for use in automobile and aerospace applications since the composition, upon curing, produces a composite having a high glass transition temperature.
摘要翻译： 本发明提供了包含苯并恶嗪单体，至少一种环氧树脂，催化剂，增韧剂和溶剂的无卤素可固化组合物。 无卤素可固化组合物特别适用于汽车和航空航天应用，因为组合物在固化后产生具有高玻璃化转变温度的复合材料。
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8.发明授权Low dielectric loss thermoset resin system at high frequency for use in electrical components 有权低介电损耗热固树脂系统在高频下用于电气元件公开(公告)号：US09580577B2
公开(公告)日：2017-02-28
申请号：US13580179
申请日：2011-03-02
申请人： Roger Tietze , Yen-Loan Nguyen
发明人： Roger Tietze , Yen-Loan Nguyen
IPC分类号： C08K5/357
CPC分类号： C08K5/357 , Y10T428/31529 , Y10T442/2475 , Y10T442/3382 , C08L63/00
摘要： The present disclosure provides a thermosetting resin composition including a benzoxazine component comprising two or more benzoxazine monomer compounds and at least one epoxy resin characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards and semiconductor devices.
摘要翻译： 本公开内容提供了一种热固性树脂组合物，其包含包含两种或更多种苯并恶嗪单体化合物的苯并恶嗪组分和至少一种环氧树脂，其特征在于通过固化所述热固性树脂组合物形成的所得固化产物在高频下具有高耐热性和低介电损耗 。 热固性树脂组合物特别适用于高速印刷电路板和半导体器件。
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9.发明申请公开(公告)号：US20120318571A1
公开(公告)日：2012-12-20
申请号：US13580179
申请日：2011-03-02
申请人： Roger Tietze , Yen-Loan Nguyen
发明人： Roger Tietze , Yen-Loan Nguyen
IPC分类号： C09D163/00 , C08K5/3492 , C08K5/53 , H05K1/00 , B05D3/02 , B32B27/04 , B32B15/092 , C08K5/5333 , B05D7/24
CPC分类号： C08K5/357 , Y10T428/31529 , Y10T442/2475 , Y10T442/3382 , C08L63/00
摘要： The present disclosure provides a thermosetting resin composition including a benzoxazine component comprising two or more benzoxazine monomer compounds and at least one epoxy resin characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards and semiconductor devices.
摘要翻译： 本公开内容提供了一种热固性树脂组合物，其包含包含两种或更多种苯并恶嗪单体化合物的苯并恶嗪组分和至少一种环氧树脂，其特征在于通过固化所述热固性树脂组合物形成的所得固化产物在高频下具有高耐热性和低介电损耗 。 热固性树脂组合物特别适用于高速印刷电路板和半导体器件。
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10.发明授权公开(公告)号：US09012543B2
公开(公告)日：2015-04-21
申请号：US11663879
申请日：2005-09-27
申请人： Roger Tietze , Dave Orser , Yefim Blyakhman , Mark Bryant , Bor-Sheng Lin
发明人： Roger Tietze , Dave Orser , Yefim Blyakhman , Mark Bryant , Bor-Sheng Lin
CPC分类号： C08K5/357 , C07D413/14 , C09K21/10 , H05K1/0373
摘要： The instant invention relates to 3,3′-bis(3,4-dihydro-3-phenyl-2H-1,3-benzoxazin-6-yl)-1(3H)-isobenzofuranone and analogues based on phenolphthalein, formaldehyde and a primary amine. Such compounds are, when cured to form polymeric networks, difficultly inflammable and resistant to high temperatures. Such compounds may especially be used in the production of printed wiring boards.
摘要翻译： 本发明涉及3,3'-双（3,4-二氢-3-苯基-2H-1,3-苯并恶嗪-6-基）-1（3H） - 异苯并呋喃酮和基于酚酞，甲醛和 伯胺。 当固化形成聚合物网络时，这些化合物难以易燃并且耐高温。 这样的化合物可以特别用于生产印刷线路板。
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