公开(公告)号：US4385063A

公开(公告)日：1983-05-24

申请号：US240840

申请日：1981-03-05

Applicant: Alexander C. Goudie ,  Robert W. Ward ,  Howard E. Rosenberg

Inventor： Alexander C. Goudie ,  Robert W. Ward ,  Howard E. Rosenberg

IPC: C07D333/24 ,  C07D495/04 ,  A61K31/40 ,  A61K31/55 ,  C07D487/04

CPC classification number: C07D495/04 ,  C07D333/24 ,  Y10S514/825

Abstract: A compound of formula (I): ##STR1## wherein: R is C.sub.1-4 alkyl;R.sub.1 is hydrogen or C.sub.1-4 alkyl;one of A and B is sulphur, and the other of A and B is carbon doubly bound to the carbon spacing A and B; andthe dotted line represents an optionally present double bond;and pro-drugs thereof; and pharmaceutically acceptable salts thereof;have useful anti-inflammatory and analgesic activity.

Abstract translation: 式（I）的化合物：其中：R是C 1-4烷基; R1是氢或C1-4烷基; A和B之一是硫，A和B中的另一个是与碳间距A和B双重结合的碳; 并且虚线表示任选存在的双键; 及其前药; 及其药学上可接受的盐; 具有有用的消炎止痛活性。

公开(公告)号：US4396626A

公开(公告)日：1983-08-02

申请号：US306534

申请日：1981-09-28

Applicant: Robert W. Ward ,  Alexander C. Goudie

Inventor： Robert W. Ward ,  Alexander C. Goudie

IPC: A61K31/40 ,  A61P29/00 ,  C07D207/32 ,  C07D207/333 ,  C07D207/337 ,  C07D207/34

CPC classification number: C07D207/333 ,  C07D207/337 ,  C07D207/34 ,  Y10S514/825

Abstract: Compounds of the formula (I): ##STR1## and pharmaceutically acceptable salts and pro-drugs thereof, wherein: Ar is a phenyl group optionally substituted by one or two moieties selected from halogen, C.sub.1-4 alkyl, methoxy, methylthio or trifluoromethyl, or a 2-thienyl group or N-methyl-2-pyrryl group optionally substituted by one or two C.sub.1-4 alkyl groups;R is hydrogen or methyl; andn is 0 or 1having useful anti-inflammatory and/or analgesic activity, pharmaceutical compositions containing them, and processes for their preparation.

Abstract translation: 式（I）的化合物：其中I和其药学上可接受的盐和前药，其中：Ar是任选被一个或两个选自卤素，C 1-4烷基，甲氧基，甲硫基的部分取代的苯基 或三氟甲基，或任选被一个或两个C 1-4烷基取代的2-噻吩基或N-甲基-2-吡咯基; R是氢或甲基; 并且n为0或1具有有用的抗炎和/或止痛活性，含有它们的药物组合物及其制备方法。

公开(公告)号：US4359423A

公开(公告)日：1982-11-16

申请号：US172419

申请日：1980-07-25

Applicant: Alexander C. Goudie ,  Robert W. Ward

Inventor： Alexander C. Goudie ,  Robert W. Ward

IPC: C07D207/34 ,  C07D209/58 ,  C07D209/52 ,  A61K31/40

CPC classification number: C07D209/58 ,  C07D207/34 ,  Y10S514/916

Abstract: A compound of formula (II): ##STR1## wherein R is a C.sub.1-4 alkyl group;R.sub.1 is a hydrogen atom or a C.sub.1-4 alkyl group;R.sub.2 is a hydrogen or halogen atom, or a C.sub.1-4 alkyl, C.sub.1-4 alkoxy or C.sub.1-4 alkylthio group;and pro-drugs thereof; and the pharmaceutically acceptable salts of the compounds of formula (II) and of their pro-drugs; has useful anti-inflammatory and analgesic activity.

Abstract translation: 式（II）的化合物：其中R是C 1-4烷基; R1是氢原子或C1-4烷基; R2是氢或卤原子，或C1-4烷基，C1-4烷氧基或C1-4烷硫基; 及其前药; 和式（II）化合物及其前药的药学上可接受的盐; 具有有用的消炎止痛活性。

公开(公告)号：US5315245A

公开(公告)日：1994-05-24

申请号：US983064

申请日：1992-11-25

Applicant: Thaddeus Schroeder ,  Chi H. Leung ,  Bruno P. B. Lequesne ,  Robert W. Ward

Inventor： Thaddeus Schroeder ,  Chi H. Leung ,  Bruno P. B. Lequesne ,  Robert W. Ward

IPC: G01R33/09 ,  H01L43/02 ,  G01R33/06 ,  G01B7/14 ,  G01R3/00 ,  H01F1/06

CPC classification number: G01R33/09 ,  H01L43/02 ,  Y10T29/49007 ,  Y10T29/49076

Abstract: A semiconductor magnetoresistive sensor and a method for its assembly is specifically provided. The preferred assembly method of this invention is compatible with automated semiconductor chip placement and packaging technology, so as to alleviate the previous requirement that the semiconductor sensing element be separately packaged. The sensor leads are substantially embedded within a powdered metal permanent magnet body. An exposed terminal end of each lead is available for electrical and adhesive contact to a subsequently attached magnetoresistive semiconductor sensing element, using conventional semiconductor placement and packaging techniques. The powdered metal magnetic body is preferably formed by utilizing powder metal compaction techniques, wherein the powder metal is compacted around the interior electrical leads. The teachings of this invention may also be employed to form a variety of electrical sensors and devices, wherein the leads are substantially embedded within a metal core so as to produce a solid assembly. The embedded leads may have a variety of shapes, such as straight or coiled, may range in number from one to a plurality, and may have a variety of physical properties, such as magnetic or non-magnetic, depending on the desired application.

Abstract translation: 具体地提供半导体磁阻传感器及其组装方法。 本发明的优选组装方法与自动半导体芯片放置和封装技术相兼容，以便减轻半导体传感元件分开封装的先前要求。 传感器引线基本上嵌入粉末状金属永磁体内。 使用常规的半导体放置和封装技术，每个引线的暴露端子可用于与随后附接的磁阻半导体感测元件的电和粘合接触。 粉末状金属磁体优选通过利用粉末金属压实技术形成，其中粉末金属在内部电引线周围压实。 本发明的教导也可用于形成各种电传感器和装置，其中引线基本上嵌入在金属芯内以便产生固体组件。 嵌入式引线可以具有各种形状，例如直线或卷绕，其数量可以在一个至多个的范围内，并且可以具有各种物理性质，例如磁性或非磁性，这取决于所需的应用。

公开(公告)号：US5175194A

公开(公告)日：1992-12-29

申请号：US881067

申请日：1992-05-11

Applicant: Robert W. Ward ,  Rogelio Tornero ,  Freeman J. Henderson

Inventor： Robert W. Ward ,  Rogelio Tornero ,  Freeman J. Henderson

IPC: C09K21/02

CPC classification number: C09K21/02 ,  Y10S521/906

Abstract: A flame retardant composition and process which is particularly useful for rebonded foam products. The composition of the present invention includes a solid component of magnesium sulfate, boric acid, decabromodiphenylethylene oxide (DECA) and antimony trioxide and a liquid component of halogenated phosphorous. The present invention is based upon the discovery of the synergism between boric acid and DECA. The process, according to the present invention, includes the steps of forming a dispersion of the solid portion of the flame retardant composition along with a small amount of water based adhesive to a mass of foam chips. The treated chips are then dried to permit handling and storage. The dried foam chips subsequently are mixed with a conventional urethane prepolymer binder and the liquid halogenated phosphorous flame retardant compound. After mixing the foam mass is transferred to molds and steamed to allow the binder to cure. Rebonded foam manufactured by this process displays excellent physical properties while, at the same time, exhibits a Flame Spread Index I.sub.s value of less than about 25.

公开(公告)号：US5004577A

公开(公告)日：1991-04-02

申请号：US528407

申请日：1990-05-25

Applicant: Robert W. Ward

Inventor： Robert W. Ward

IPC: H02K1/17 ,  H02K5/02 ,  H02K15/03

CPC classification number: H02K1/17 ,  H02K15/03 ,  H02K5/02

Abstract: A frame and permanent magnet assembly for a dynamoelectric machine where the frame carries a plurality of permanent magnets. The frame is formed of iron powder particles that are bound together by a thermoplastic material. In the manufacture of the assembly, iron powder particles that are coated with a thermoplastic material are molded to the permanent magnets. The permanent magnets have surfaces that are interlocked to the material of the frame thereby eliminating the need for mechanical fasteners or an adhesive to secure the permanent magnets to a frame.

Abstract translation: 一种用于电动机的框架和永磁体组件，其中框架承载多个永磁体。 框架由通过热塑性材料结合在一起的铁粉颗粒形成。 在组装的制造中，涂覆有热塑性材料的铁粉颗粒被模制到永磁体上。 永磁体具有与框架的材料互锁的表面，从而不需要机械紧固件或将永磁体固定到框架上的粘合剂。

公开(公告)号：US5536985A

公开(公告)日：1996-07-16

申请号：US240047

申请日：1994-05-09

Applicant: Robert W. Ward ,  Sam B. Parker ,  David A. Score

Inventor： Robert W. Ward ,  Sam B. Parker ,  David A. Score

IPC: H02K1/02 ,  H02K1/22 ,  H02K15/02 ,  H02K15/12 ,  H02K23/26 ,  H02K23/40 ,  H02K15/06

CPC classification number: H02K15/12 ,  H02K1/22 ,  H02K15/02 ,  H02K1/02 ,  H02K15/028 ,  H02K23/26 ,  H02K23/40

Abstract: A method of manufacturing an armature for a DC motor comprising the steps of: (a) retaining a plurality of armature conductors pre-positioned in a pre-mold position; (b) placing the armature conductors in a mold; (c) adding to the mold a predetermined quantity of soft-magnetic particles, each soft-magnetic particle coated with a non-magnetic material, wherein said particles surround at least a portion of each of the conductors; (d) applying pressure to the mold to affect a compaction molding of the coated soft magnetic particles into a composite structure, wherein the particles and the non-magnetic material form a composite structure armature core substantially encapsulating the conductors within the armature core.

Abstract translation: 一种制造用于直流电动机的电枢的方法，包括以下步骤：（a）保持预定位在预模具位置的多个电枢导体; （b）将电枢导体放置在模具中; （c）向模具中加入预定量的软磁性颗粒，每个软磁性颗粒涂覆有非磁性材料，其中所述颗粒围绕每个导体的至少一部分; （d）向模具施加压力以影响涂覆的软磁性颗粒的压实成型为复合结构，其中所述颗粒和所述非磁性材料形成基本上将所述导体密封在所述电枢芯内的复合结构电枢芯。

公开(公告)号：US5271891A

公开(公告)日：1993-12-21

申请号：US915587

申请日：1992-07-20

Applicant: David E. Gay ,  Robert W. Ward

Inventor： David E. Gay ,  Robert W. Ward

IPC: B22F1/02 ,  B22F1/00 ,  H01F1/22

CPC classification number: B22F1/0059 ,  H01F1/22

Abstract: A polymeric coating material is provided for coating powdered materials and, more particularly, for coating powdered metals formed into parts and sintered, such as to form magnetic cores. The thermoplastic material is polyphenylene oxide which, when properly applied to metal particles to form a magnetic core, is characterized by being sufficiently volatile so as to prevent the formation of contaminants or voids within the sintered article which would be detrimental to the physical properties of the sintered article. Moreover, polyphenylene oxide provides sufficient lubrication and adhesion between adjacent metal particles during an initial compaction process so as to sustain the desired shape of the molded article and maximize metal particle density without the use of additional lubricants, thereby preventing the formation of additional contaminants and/or voids within the resultant sintered article from these lubricants.

公开(公告)号：US5216405A

公开(公告)日：1993-06-01

申请号：US640774

申请日：1991-01-14

Applicant: Thaddeus Schroeder ,  Bruno P. B. Lequesne ,  Donald E. Lake ,  John S. Zgunda ,  Daniel I. Feaster ,  George A. Shinkle ,  Robert W. Ward

Inventor： Thaddeus Schroeder ,  Bruno P. B. Lequesne ,  Donald E. Lake ,  John S. Zgunda ,  Daniel I. Feaster ,  George A. Shinkle ,  Robert W. Ward

IPC: G01B7/00 ,  G01D5/14 ,  G01D5/16 ,  G01D5/245 ,  G01R33/09 ,  H01L43/02 ,  H01L43/08

CPC classification number: G01D5/147 ,  G01R33/09 ,  H01L43/08 ,  H01L2224/48091

Abstract: A package for a magnetic field sensitive element, such as a magnetoresistor, includes at least two planar layers of a relatively stiff ferromagnetic material which is also electrically conductive. The layers have opposed edges which are in closely spaced relation to form a narrow gap therebetween. A terminal tab is integral with and extends from each layer. A magnetic field sensitive element is on a surface of at least one of the layers and preferably extends across the gap to be on both layers. The magnetic field sensitive element has a pair of contacts each of which is electrically connected to a separate one of the layers. A permanent magnet is mounted on and insulated from the surface of the layers opposite the magnetic field sensitive element. A protective layer of an insulating material may cover the magnetic field sensitive element and the layers with the terminal tabs extending therefrom.

Abstract translation: 用于磁场敏感元件（例如磁电阻器）的封装包括至少两个也是导电的相对硬的铁磁材料的平面层。 这些层具有彼此紧密间隔的相对边缘，以在它们之间形成窄的间隙。 端子片与每层叠合并从其延伸。 磁场敏感元件在至少一个层的表面上，并且优选地跨越间隙延伸到两个层上。 磁场敏感元件具有一对触点，每个触点电连接到单独的一个层。 永磁体安装在与磁场敏感元件相对的层的表面上并与之绝缘。 绝缘材料的保护层可以覆盖磁场敏感元件，并且具有从其延伸的端子突片的层。

公开(公告)号：US4935404A

公开(公告)日：1990-06-19

申请号：US270085

申请日：1988-11-14

Applicant: David J. Hunter ,  Roger E. Markwell ,  Robert W. Ward

Inventor： David J. Hunter ,  Roger E. Markwell ,  Robert W. Ward

IPC: A61K38/55 ,  A61K38/00 ,  A61P29/00 ,  A61P35/00 ,  A61P37/08 ,  A61P43/00 ,  C07F9/30 ,  C07F9/38 ,  C07F9/40 ,  C07F9/572 ,  C07K5/06

CPC classification number: C07F9/4006 ,  C07K5/06191 ,  A61K38/00

Abstract: Novel compounds of the formula (I), a process for their preparation and their use as collagenase inhibitors are described: ##STR1## in which R.sub.1 is hydrogen or hydroxy; R.sub.2 is hydrogen or alkyl; R.sub.3 is C.sub.3-6 alkyl; R.sub.4 is hydrogen, alkyl, --CH.sub.2 --Z where Z is optionally substituted phenyl or heteroaryl, or R.sub.4 is a group ##STR2## where R.sub.8 is hydrogen, alkyl or --CH.sub.2 --Ph where Ph is optionally substituted phenyl, and R.sub.9 is hydrogen or alkyl; and R.sub.5 is hydrogen or alkyl.