Cleaning apparatus with vapor containment system
    1.
    发明授权
    Cleaning apparatus with vapor containment system 失效
    清洁装置与蒸汽容纳系统

    公开(公告)号:US5090431A

    公开(公告)日:1992-02-25

    申请号:US531937

    申请日:1990-06-01

    CPC classification number: C23G5/04 Y10S203/05

    Abstract: A cleaning apparatus having a container for holding a quantity of cleaning agent, which is vaporized and condensed to form an upper vapor layer. Essentially, the container is divided into a lower chamber, for holding the cleaning agent, and an upper chamber for containing the vapors. One or more heat pumps are adapted to establish a relatively low temperature in the upper region to condense the vapors released by the lower heating process. Multiple high thermally conductive shunting devices are coupled between the high temperature end of the heat pumps and the bottom portion of the container to transfer extracted heat from the upper portion to the lower portion, to augment the vaporization process.

    Abstract translation: 一种具有用于容纳一定量的清洁剂的容器的清洁装置,其被蒸发和冷凝以形成上蒸气层。 基本上,容器被分成用于保持清洁剂的下室和用于容纳蒸气的上室。 一个或多个热泵适于在上部区域建立相对较低的温度,以冷凝由较低加热过程释放的蒸气。 多个高导热分流装置耦合在热泵的高温端和容器的底部之间,以将提取的热量从上部转移到下部,以增加汽化过程。

    Modular power supply
    3.
    发明授权
    Modular power supply 失效
    模块化电源

    公开(公告)号:US5057988A

    公开(公告)日:1991-10-15

    申请号:US437986

    申请日:1989-11-16

    CPC classification number: H02M7/106

    Abstract: Disclosed is a system comprising a plurality of networks, encapsulated in substantially electrically non-conductive materials and positioned interior to the outer surface of an encasement region. According to the invention, at least one outer surface of at least one of the encapsulated networks is complementary to, adjacent to, and in physical contact with at least one outer surface of at least one other of the encapsulated networks. Also disclosed is a method for constructing the system. In a preferred embodiment, the system is a toroidally shaped power supply whose modular structure facilitates ease of testing and assembly, affords considerable space savings, substantially reduces manufacturing waste costs, and eliminates a proven source of circuit failure.

    Abstract translation: 公开了一种包括多个网络的系统,其被封装在基本上不导电的材料中并且被定位在包围区域的外表面的内部。 根据本发明,至少一个封装网络的至少一个外表面与封装网络中的至少一个其他封装网络的至少一个外表面互补,相邻并物理接触。 还公开了一种构建该系统的方法。 在优选实施例中,该系统是环形形状的电源,其模块化结构便于测试和组装,便于节省空间,大大降低了制造废料成本,并消除了久经考验的电路故障源。

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