Abstract:
Disclosed is a component carrier adapted for mounting components on curved surfaces. The carrier comprises a rigid base member having a top surface adapted for supporting a component and a bottom surface curved to mount flush to a complementary curved support surface.
Abstract:
A cleaning apparatus having a container for holding a quantity of cleaning agent, which is vaporized and condensed to form an upper vapor layer. Essentially, the container is divided into a lower chamber, for holding the cleaning agent, and an upper chamber for containing the vapors. One or more heat pumps are adapted to establish a relatively low temperature in the upper region to condense the vapors released by the lower heating process. Multiple high thermally conductive shunting devices are coupled between the high temperature end of the heat pumps and the bottom portion of the container to transfer extracted heat from the upper portion to the lower portion, to augment the vaporization process.
Abstract:
A solid-state lamp includes a first plurality of solid-state emitters that emit light at visible wavelengths and a second plurality of solid-state emitters that emit light at a safe ultraviolet wavelength, wherein the second plurality of solid-state emitters emit light at least when the first plurality of solid-state emitters emit light.
Abstract:
A microcurrent stimulation device with a power supply, two or more electrodes electronically coupled to the power supply, a microcontroller configured to generate an electromagnetic waveform, an impedance measurement module configured to measure electrical impedance of one or more biological tissues between the two or more electrodes. A first safety circuit monitors electric current flow through one or more components of the microcurrent stimulation device and interrupts electric current flow if the electric current flow through the one or more components is above a predetermined level. A second safety circuit interrupts electric current flow through the one or more components if a firmware failure occurs.
Abstract:
Disclosed is a system comprising a plurality of networks, encapsulated in substantially electrically non-conductive materials and positioned interior to the outer surface of an encasement region. According to the invention, at least one outer surface of at least one of the encapsulated networks is complementary to, adjacent to, and in physical contact with at least one outer surface of at least one other of the encapsulated networks. Also disclosed is a method for constructing the system. In a preferred embodiment, the system is a toroidally shaped power supply whose modular structure facilitates ease of testing and assembly, affords considerable space savings, substantially reduces manufacturing waste costs, and eliminates a proven source of circuit failure.